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Title:
FULLY-AUTOMATIC VISION SILICON WAFER PRINTING DEVICE WITH DOUBLE PLATFORMS
Document Type and Number:
WIPO Patent Application WO/2013/166837
Kind Code:
A1
Abstract:
A fully-automatic vision silicon wafer printing device with double platforms comprises two silicon wafer bearing platforms (1, 2), two inlet-outlet plate detection cameras (12, 13), a screen lifting device (4), a screen gesture adjusting mechanism (3), two screen reference point cameras (10, 11), an ink scraping device (5), two sets of silicon wafer loading devices (6, 7), two sets of silicon wafer unloading devices (8, 9) and two sets of buffer transportation lines (4-18, 19-23). The two silicon wafer bearing platforms are installed on a transversely-moving base (24) and can enter a printing position to perform ink scraping operation alternately, and the silicon wafer bearing platform which is not in the printing position can synchronously load and unload silicon wafers. The printing device uses a double-silicon-wafer-bearing-platform structure, can achieve parallel operation of processes of wafer changing and printing, improves production efficiency, is compact in structure, and occupies a small area.

Inventors:
ZHANG XIANMIN (CN)
KUANG YONGCONG (CN)
OUYANG GAOFEI (CN)
CHEN JIAZHAO (CN)
HAN JIAPENG (CN)
Application Number:
PCT/CN2012/086894
Publication Date:
November 14, 2013
Filing Date:
December 19, 2012
Export Citation:
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Assignee:
UNIV SOUTH CHINA TECH (CN)
International Classes:
B41F15/08; B41F15/00; B41F15/20; H01L31/00
Foreign References:
CN102700237A2012-10-03
CN102037555A2011-04-27
CN102326459A2012-01-18
CN202186104U2012-04-11
CN101801667A2010-08-11
Attorney, Agent or Firm:
YOGO PATENT & TRADEMARK AGENCY LIMITED COMPANY (CN)
广州粤高专利商标代理有限公司 (CN)
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