FUNCTIONAL LAYER REMOVAL METHOD AND FUNCTIONAL LAYER REMOVAL DEVICE

WIPO Patent Application WO/2023/189625

A1

Provided is a functional layer removal method which efficiently removes a functional layer from a laminate film, which has a functional layer, without requiring high-alkalinity conditions or high-temperature/high-pressure conditions. Also provided is a functional layer removal device capable of being used in such a method.　A functional layer removal method according to an embodiment of the present invention removes a functional layer from a laminate film including a substrate layer and the functional layer. (i) An aqueous solution including a surfactant and a tool which applies ultrasonic waves and shear force are brought into contact with the functional layer. (ii) The laminate film is introduced into the aqueous solution containing the surfactant and stirred, the mass ratio of the laminate film and the aqueous solution being 1:2.5 to 1:4. (iii) The aqueous solution containing the surfactant is brought into contact with the functional layer, the aqueous solution being at least one solution selected from solutions having a contact angle α of 45° or less relative to the substrate layer and a contact angle β relative to the functional layer which is greater than the contact angle α relative to the substrate layer.

YAMAMOTO AKIYOSHI (JP)
KAWATAKE FUMIKA (JP)
YAMADA YOSUKE (JP)
YAMAGUCHI NIHO (JP)

PCT/JP2023/010191

October 05, 2023

March 15, 2023

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NITTO DENKO CORP (JP)

B29B17/02; B09B3/30; B09B3/38

WO2021199895A1	2021-10-07
WO2012035673A1	2012-03-22

JP2005297424A	2005-10-27
JP2006051637A	2006-02-23
JP2001310970A	2001-11-06
JP2017124553A	2017-07-20
JP2016103100A	2016-06-02
JP2021187869A	2021-12-13

KAMADA Koichi et al. (JP)

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