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Patent Searching and Data


Title:
GAS BARRIER FILM, PACKAGING FILM, AND PACKAGING BAG
Document Type and Number:
WIPO Patent Application WO/2023/219141
Kind Code:
A1
Abstract:
A gas barrier film comprising, in order: a substrate layer that includes a polypropylene resin; a vapor deposition layer that includes an inorganic oxide; and a gas barrier coating layer. The substrate layer comprises a first skin layer and a core layer. The vapor deposition layer is formed on the first skin layer side. As measured according to a nano-indentation method, the hardness of the first skin layer is 0.02-0.15 Gpa, the hardness of the core layer is 0.07 Gpa or greater, and the hardness of the core layer is greater than the hardness of the first skin layer.

Inventors:
FUKUGAMI MIKI (JP)
FURUTA KAORU (JP)
SASAKI NORIKO (JP)
Application Number:
PCT/JP2023/017786
Publication Date:
November 16, 2023
Filing Date:
May 11, 2023
Export Citation:
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Assignee:
TOPPAN INC (JP)
International Classes:
B32B27/00; B32B9/00; B32B27/32; B65D65/40
Domestic Patent References:
WO2021230319A12021-11-18
WO2022085586A12022-04-28
WO2020129291A12020-06-25
WO2020085463A12020-04-30
Foreign References:
JP2006159801A2006-06-22
JPH09290477A1997-11-11
JP2021028394A2021-02-25
JP2000233476A2000-08-29
JP2021041620A2021-03-18
JP2017177685A2017-10-05
JP2017069203A2017-04-06
JP2023056928A2023-04-20
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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