Title:
GAS BARRIER FILM AND PACKAGING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/106096
Kind Code:
A1
Abstract:
The present invention relates to: a gas barrier film that contains a hetero atom compound having dehydration condensation properties, and a resin (A) having carboxyl groups; and a packaging material and a packaging material for heat sterilization that include the gas barrier film. It is preferable that the present invention has a resin layer (B) including a polyvalent metal compound adjacent to the resin layer (A), and that the resin forming the resin layer (B) is one or more selected from ethyl cellulose resins, polyether polyurethane polyol resins, polyester polyol resins, and polyurethane polyol resins.
Inventors:
OKUBO TOMOO (JP)
HARADA TOMOAKI (JP)
HARADA TOMOAKI (JP)
Application Number:
PCT/JP2022/043263
Publication Date:
June 15, 2023
Filing Date:
November 24, 2022
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
B32B27/08; C08J7/048; C08K3/28; C08K3/30; C08K3/32; C08L33/00; C08L35/00
Foreign References:
| JP2021079597A | 2021-05-27 | |||
| JP2021133606A | 2021-09-13 | |||
| JP2018126971A | 2018-08-16 | |||
| JP2017217845A | 2017-12-14 | |||
| JP2007112114A | 2007-05-10 |
Attorney, Agent or Firm:
ONO Takayuki (JP)
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