Title:
GAS FEEDING NOZZLE DEVICE AND PLASMA ETCHING MACHINE
Document Type and Number:
WIPO Patent Application WO/2024/104265
Kind Code:
A1
Abstract:
A gas feeding nozzle device and a plasma etching machine. The gas feeding nozzle device is used for supplying a process gas to a reaction chamber; the gas feeding nozzle device comprises a gas feeding nozzle and a nozzle seat sealingly connected to the reaction chamber; the nozzle seat is provided with an axial channel; the gas feeding nozzle is mounted in the axial channel and capable of moving in the axial direction relative to the nozzle seat to move away from or close to a wafer in the reaction chamber. The gas feeding nozzle of the gas feeding nozzle device in the present application can move in the axial channel of the nozzle seat, that is, the height of the gas feeding nozzle relative to the wafer can be adjusted. In this way, for wafers of different materials, the gas feeding nozzle can be adjusted to different heights, to adjust the gas feeding condition and improve etching uniformity.
Inventors:
LI NA (CN)
HAN DAJIAN (CN)
WANG HAIDONG (CN)
GUO SONG (CN)
MA SHISHENG (CN)
ZHANG BIAO (CN)
HU DONGDONG (CN)
XU KAIDONG (CN)
HAN DAJIAN (CN)
WANG HAIDONG (CN)
GUO SONG (CN)
MA SHISHENG (CN)
ZHANG BIAO (CN)
HU DONGDONG (CN)
XU KAIDONG (CN)
Application Number:
PCT/CN2023/130956
Publication Date:
May 23, 2024
Filing Date:
November 10, 2023
Export Citation:
Assignee:
JIANGSU LEUVEN INSTR CO LTD (CN)
International Classes:
H01J37/32; H01L21/3065
Foreign References:
| KR20160054146A | 2016-05-16 | |||
| CN1846871A | 2006-10-18 | |||
| JPH09115887A | 1997-05-02 | |||
| KR20090051984A | 2009-05-25 | |||
| US20020008082A1 | 2002-01-24 |
Attorney, Agent or Firm:
UNITALEN ATTORNEYS AT LAW CO., LTD. (CN)
Download PDF:
Previous Patent: SIGNAL SENDING METHOD AND APPARATUS
Next Patent: RESOURCE INDICATION METHOD AND APPARATUS
Next Patent: RESOURCE INDICATION METHOD AND APPARATUS