Title:
GAS INJECTION DEVICE OF SEMICONDUCTOR HEAT TREATMENT APPARATUS, AND SEMICONDUCTOR HEAT TREATMENT APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/036046
Kind Code:
A1
Abstract:
Provided are a gas injection device of a semiconductor heat treatment apparatus, and a semiconductor heat treatment apparatus (100). The device comprises: a gas intake pipe (1, 3, 5), and a first pipe section (11, 31, 51) comprising a first pipe wall (111, 311, 511) and a second pipe wall (112, 312, 512) nested in the first pipe wall (111, 311, 511), wherein a buffer space (13, 33, 53) is formed between an inner wall of the first pipe wall (111, 311, 511) and an outer wall of the second pipe wall (112, 312, 512); a plurality of first gas holes (21, 41, 61) are uniformly distributed in the first pipe wall (111, 311, 511) in a vertical direction, and the first gas holes (21, 41, 61) are respectively in communication with the buffer space (13, 33, 53) and a process chamber; a plurality of second gas holes (22, 42, 62) are provided in the second pipe wall (112, 312, 512), and the second gas holes (22, 42, 62) are respectively in communication with an inner space (14, 34, 54) of the second pipe wall (112, 312, 512) and the buffer space (13, 33, 53); and the change rule of an inner diameter of the second pipe wall (112, 312, 512) in a vertical direction and/or the arrangement rule of the plurality of second gas holes (22, 42, 62) can satisfy the condition of the gas output of a process gas flowing into the buffer space (13, 33, 53) via the plurality of second gas holes (22, 42, 62) being the same at different positions in a vertical direction. In this way, it can be ensured that different wafers (106) can obtain a uniform amount of gas, thereby ensuring the uniformity of the thickness of film formation of the wafers (106) and the consistency of process results.
Inventors:
LAN LIGUANG (CN)
Application Number:
PCT/CN2022/116481
Publication Date:
March 16, 2023
Filing Date:
September 01, 2022
Export Citation:
Assignee:
BEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD (CN)
International Classes:
C23C16/455; C30B31/10; H01L21/67
Foreign References:
| CN111725108A | 2020-09-29 | |||
| CN103510045A | 2014-01-15 | |||
| JP2007317745A | 2007-12-06 | |||
| CN113755823A | 2021-12-07 | |||
| JP2020017757A | 2020-01-30 |
Attorney, Agent or Firm:
TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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