GERMINATION DEVICE CROSS-REFERENCE TO RELATED APPLICATION This application claims priority from South African provisional patent application number 2021/02556 filed on 19 April 2021, which is incorporated by reference herein. FIELD OF THE INVENTION The present disclosure relates to the field of horticulture or agriculture. More particularly, but not exclusively, the present disclosure relates to seed germination and seedling propagation. BACKGROUND TO THE INVENTION Germination is the process by which an organism grows from a seed, spore, or similar structure. Germination usually occurs when a plant contained within a seed grows, resulting in the formation of a seedling that sprouts from the seed. Germination can also occur when an organism grows from a spore. Various plants require different variables for successful germination. These variables include temperature, water, oxygen or air and sometimes light or darkness. Germination is required when seeds or spores are to be grown, and a known method of germination of seeds involves placing a tray of seeds planted in separate soil lumps onto a heated seed-propagation mat. A problem with this heated mat arrangement is that the temperature of each seed or seedling cannot be efficiently or accurately controlled by the mat. This may lead to less than optimal growth of the seedlings, or sometimes no growth may occur at all. The applicant considers there to be room for improvement. The preceding discussion of the background to the invention is intended only to facilitate an understanding of the present invention. It should be appreciated that the discussion is not an acknowledgment or admission that any of the material referred to was part of the common general knowledge in the art as at the priority date of the application. SUMMARY OF THE INVENTION In accordance with an aspect of the present disclosure there is provided a germination device comprising: a heat transfer body having one or more receptacles for operatively receiving seeds or spores therein; and a temperature controlling element which is connected to the heat transfer body and configured to heat or cool the receptacles to a selected temperature, so as to facilitate germination of the seeds or spores in the receptacles in use. The temperature controlling element may include a heating element, or a cooling element, or both a heating element and a cooling element. The heat transfer body may be in the form of, or be shaped as a heat sink body. The heat transfer body may include a plurality of grooves or depressions, and a plurality of protrusions or ridges. The heat transfer body may be a passive heat exchanger. The heat sink body may be arranged as a passive heat exchanger. The heat transfer body may be generally planar or substantially flat. The heat transfer body may include an upper surface which may include the plurality of grooves or depressions, and the plurality of protrusions or ridges. The protrusions or ridges may be shaped as fins that are capable of transferring heat. The plurality of grooves or depressions, and the plurality of protrusions or ridges may be at least partially interposed between the one or more receptacles of the heat transfer body. The grooves or depressions and the protrusions or ridges may be arranged to facilitate heat from the heating element, or cooling from the cooling element, to be distributed to the one or more receptacles in use. The grooves or depressions and the protrusions or ridges may be arranged to distribute heat substantially uniformly among the receptacles. The heat transfer body may be shaped so as to conduct heat therethrough, or to regulate heat that conducted therethrough in use. The heat transfer body may also be shaped to provide cooling from the cooling element to the receptacles. The heat transfer body may be shaped to conduct heat from the heating element to the receptacles. The heat transfer body may be shaped so as to conduct heat substantially uniformly to each of the receptacles. The one or more receptacles may be recesses, holes or cavities in the heat transfer body. For example, the receptacles may be one or more recesses, holes or cavities provided in the upper surface of the heat transfer body. Each of the one or more receptacles may be arranged to receive one or more pads therein. Each receptacle may act as a cradle for a respective one of the seeds or spores. The pad may for example be wetted prior to insertion into a receptacle to facilitate germination. The pad may be a cotton or fabric pad for protecting the seed or spore during germination. Optionally, first and second pads may be used for each seed or spore, so as to cover and protect the seed or spore inside the receptacle during germination. Each pad may be shaped and configured to fit snugly inside a receptacle. The germination device may include a removable lid. The lid may be shaped to at least partially close the one or more receptacles after the seeds or spores are placed therein. The lid may further be configured to at least partially contain heated or cooled air inside the germination device during germination. At least some of the grooves may extend to an exterior of the germination device with the lid in place, so as to enable air to circulate towards or from the receptacles. The germination device may further include insulation. The insulation may for example be provided around the outer periphery of the heat transfer body, or the lid may be insulated, so as to at least partially contain heated or cooled air inside the germination device during germination of the one or more seeds or spores. The heating element may be an electric heating element. The cooling element may be an electric cooling element. The electric heating element may be arranged to be connected to a power source to heat the electric heating element. The heating element may be configured to supply heat to the heat transfer body of the germination device. The heat may for example be provided by conduction. The heating element may be shaped so as to facilitate substantially uniform heat conduction throughout the heat transfer body. The heating element or cooling element may be coiled, looped or spread out throughout an area of the heat transfer body. The heat transfer body and the plurality of grooves or depressions, and the plurality of protrusions or ridges may be arranged to conduct heat from the heating element to the one or more receptacles. The heat transfer body and the plurality of grooves or depressions, and the plurality of protrusions or ridges may be arranged to convey cooling from the cooling element to the one or more receptacles. The arrangement may be such that heat may be substantially uniformly provided to each of the receptacles. The germination device may include a temperature control component. The temperature control component may be arranged to provide power from the power source to the temperature controlling element, so as to heat or cool the heat transfer body and receptacles to or near the selected temperature. The selected temperature may be preselected, predefined, or selected in advance. Optionally, the temperature control component may include a temperature sensor arranged to sense temperature in the heat transfer body, or at one or more of the receptacles. The temperature sensor may be arranged to provide temperature feedback to the temperature control component. The temperature control component may be arranged to receive the temperature feedback, and to preferably automatically regulate the temperature of the heat transfer body at or near the selected temperature. The selected temperature may be about 20 °C, or between 15 °C to 25 °C. Other selected temperatures may be implemented, depending on the type of seeds or spores to be germinated. For example, the selected temperature may be about 0 °C or between -5 °C to 5 °C for seeds or spores that require relatively cold temperatures to germinate. Or the selected temperature may be about 28 °C or between 20 °C to 35°C for seeds or spores that require relatively warmer temperatures to germinate. The selected temperature may be adjustable, for example to accommodate different types of seeds or spores. The selected temperature may be a temperature selected between -5 °C to 35 °C. The temperature control component may be arranged to control the selected temperature automatically. The selected temperature may be dynamically controlled, for example relative to the time of day, or the time of year. A timing component may be provided. The timing component may for example be arranged to time a duration of time that the seeds or spores are inside the receptacles. Optionally, the temperature control component may be arranged to adjust the selected temperature relative to an amount of time since placement of the one or more seeds or spores in the receptacles. In other words, the temperature control component may adjust or vary temperature of the heat transfer body and/or receptacles, dependant on a number of days, hours or minutes that the seeds or spores are in the receptacles. The heat transfer body may be made from a material suited to conduct heat. The material may, for example, be a metal selected from the group consisting of aluminium, copper, iron and steel. The material of the heat transfer body may be an alloy, such as an aluminium alloy or brass. Alternatively, non-metallic materials, metalloids, or a combination of materials may be used to make the heat transfer body. The material of the heat transfer body may be selected so as to be corrosion resistant. Alternatively, the heat transfer body may be treated with a corrosion resistant agent or substance. In particular, the material of the receptacles may be selected so as to be corrosion resistant, or the receptacles may be treated with the corrosion resistant agent or substance. The heat transfer body may be reusable, and the corrosion resistance of the heat transfer body may facilitate reuse thereof. The heat transfer body of the germination device may be configured to be used with a propagator, or the germination device may include a propagator. The propagator may include a holder having one or more holes or holding formations for holding compressed matter for the seeds or spores to grow in or through. The compressed matter may for example be compressed soil, compost, fertiliser, organic material, combinations of these, or the like. The compressed matter may be shaped as pellets that are receivable inside the holes or holding formations in the holder of the propagator. The propagator may include a cover which may optionally be transparent or translucent. The transparency or translucency of the cover may enable light to pass therethrough, so as to provide light to plants, fungi or organisms grown from the seeds or spores inside the germination device. The cover may further be shaped so as to substantially contain water vapor therein. A humidity regulator may be provided for regulating the humidity inside the cover of the propagator. The germination device may be arranged to have the propagator installed thereon, to facilitate propagation of each plant, fungus or organism grown from the respective seeds or spores. In accordance with another aspect of the present disclosure there is provided a germination method comprising: providing a heat transfer body having one or more receptacles for operatively receiving seeds or spores therein; and by a temperature controlling element, enabling the receptacles of the body to be heated or cooled to a selected temperature, so as to facilitate germination of seeds or spores in the receptacles in use. Further features of the method may include steps to implement features of the germination device as defined above. Embodiments of the invention will now be described, by way of example only, with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS In the drawings: Figure 1 is a three-dimensional view of an exemplary embodiment of a germination device; Figure 2 is a three-dimensional exploded view of the germination device of Figure 1; Figure 3 is another three-dimensional exploded view of the germination device of Figure 1, showing seeds and pads that may be used therewith; Figure 4 is a three-dimensional view of an exemplary embodiment of a heat transfer body or heat sink body of the germination device; Figure 5 is a bottom view of the exemplary heat transfer body of Figure 4; Figure 6 is a three-dimensional view of another exemplary embodiment of a germination device with a propagator; Figure 7 is an exploded front view of the germination device and propagator of Figure 6; Figure 8 is a three-dimensional exploded view of the germination device and propagator of Figure 6; Figure 9 is a high-level block diagram of a temperature control component that may form part of the germination device of the present disclosure; Figure 10 is a flow diagram of an exemplary germination method; Figure 11 is a three-dimensional exploded view of yet another embodiment of the germination device and propagator; Figure 12 is a three-dimensional exploded view of the germination device of Figure 11 (without the propagator), also showing seeds and pads that may be used; Figure 13 is a similar view as Figure 12, without the seeds and pads, but also showing a closure for electrical components of the germination device; and Figure 14 is an assembled three-dimensional view of the germination device and propagator of Figure 11. DETAILED DESCRIPTION WITH REFERENCE TO THE DRAWINGS There is disclosed a germination or sprouting device. The device may be used to sprout plants or organisms that grow from seeds, spores or similar structures. This may include plants that are grown from seeds, other plants, fungi or mushrooms that are grown from spores, moss, algae or any living organism which may need to be grown in a controlled environment. The present disclosure may find particular application in the horticultural or agricultural fields, including the cannabis industry which has recently been legalised for medicinal purposes in many parts of the world. However, the present disclosure may also find application in other fields. The germination device may have a body that is shaped similarly to a heat sink, or the structure of the device may be shaped so as to act as a sink or heat transfer body, which may be arranged to transfer heat from a heating element to the seeds, or to provide cooling to the seeds. Seeds, spores or the like may germinate or start to grow at different temperatures, and the germination device may be configured to adjust the temperature of the seeds when they are placed in openings or receptacles inside the heat transfer body. A propagation or growth promoting unit may be used with the germination device. Alternatively, or in addition, embodiments are possible wherein the germination device itself includes a propagator or growth promoting unit. The propagator and/or the germination device may include a transparent cover which may be domed, and which may contain or regulate humidity therein, so as to provide a suitable environment for plants, fungi or organisms grown, for example in a similar way than that of a greenhouse. A light source may optionally be provided to promote growth after the seedlings, plants, fungi or organisms have started to grow. An example embodiment of a germination device is shown in Figures 1 to 5. Another exemplary embodiment of the germination device is shown in Figures 6 to 8, in which the germination device may be used with a propagator, or wherein the germination device includes a propagator. A high-level block diagram of an exemplary temperature control component is shown in Figure 9 and an exemplary method is shown in Figure 10. Yet another exemplary embodiment of the germination device is shown in Figures 11 to 14. Referring to Figures 1 to 5, there is shown a germination device (10) according to an exemplary embodiment of the present disclosure. The germination device (10) may include a body (12) which may be referred to as a heat sink body or a heat transfer body (12). The body (12) may be shaped as a heat sink. The heat transfer body or heat sink body may be, or may act as, or may be shaped as a passive heat exchanger. The heat transfer body (12) may have one or more receptacles (14) for operatively receiving seeds (16) or spores therein. In the present embodiment, seeds (16) are shown (see Figure 3), however it will be appreciated that the germination device may also be used for the germination of spores or any structure similar to a seed or spore from which an organism grows. Two seeds (16) are shown by broken lines in Figure 2 for a first and a second receptacle, and these seeds (16) may be provided inside pads (30) which are described in more detail below. The rest of the receptacles (14) may also have seeds or spores in them in use. The germination device (10) may include a temperature controlling element (18) which may be connected to the heat transfer body (12). The temperature controlling element (18) may include a heating element, or a cooling element, or both a heating element and a cooling element as will be appreciated by those skilled in the art. For example, a thermoelectric heating element or cooling element or another type of electric heating element or electric cooling element may be used. The heating element (18) or cooling element may for example be embedded in the heat transfer body (12), or it may be attached to the heat transfer body (12). The heating element (18) may be configured to heat the receptacles (14) to a selected temperature, so as to facilitate germination of the seeds (16) or spores in the receptacles (14) in use. The heat transfer body (12) may include a plurality of grooves (20) or depressions, and a plurality of protrusions (22) or ridges. The heat transfer body (12) may be generally planar, or substantially flat, and the heat transfer body (12) may include an upper surface (24). The plurality of grooves (20) or depressions, and the plurality of protrusions (22) or ridges may be provided in or on the upper surface (24) of the heat transfer body (12). The protrusions (22) or ridges may also be referred to as fins or heat sink fins, or they may be shaped as fins which may be capable of transferring heat. The plurality of grooves (20) or depressions, and the plurality of protrusions (22) or ridges may be at least partially interposed between the receptacles (14) of the heat transfer body (12). The grooves (20) or depressions and the protrusions (22) or ridges may be arranged to facilitate heat from the heating element (18) (or cooling from the cooling element) to be distributed to or between the receptacles (14) in use. The grooves (20) or depressions and the protrusions (22) or ridges may be arranged to distribute heat substantially uniformly among the receptacles (14). The heat transfer body (12) may be shaped so as to conduct heat therethrough. Heat conducted through the heat transfer body (12) in use may be regulated. The conducted heat may be regulated by the shape of the heat transfer body (12), by the placement or positioning of the heating element, and/or by a temperature control component (26) which is described in more detail below. The heat transfer body (12) may be shaped to conduct heat from the heating element (18) to the receptacles (14). The heat transfer body (12) may be shaped so as to conduct heat substantially uniformly to each of the receptacles (14). The placement of the grooves and ridges (20, 22) may facilitate the substantially uniform distribution or conduction of heat to each of the receptacles (14). The grooves and ridges (20, 22) may be spaced such that the distance from one groove to the next is about 5 mm. Each groove (20) may be about 3 mm wide, or about 4mm or about 5mm. Each ridge may be about 5 mm wide, or about 4mm, or about 6mm wide, the width of the ridges or grooves being measured along a major axis (28) of the heat transfer body (12) in the present embodiment. The width of the grooves may be selected so as to enable air to pass in between the ridges, to cool down the receptacles. A groove width of about 3mm may provide the advantage that enough air may pass between the ridges to cool (or warm) the receptacles with their seeds or spores, but not too much air, so that the seeds or spores do not dry out. Outer edges of the receptacles (14) may also be spaced about 7 mm from one another, or between 5mm and 10mm from one another. The heat transfer body may also be shaped to provide cooling from the cooling element to the receptacles. It will be appreciated that many other sizes of grooves, ridges or other spacing of receptacles may be used. The receptacles may be about 35mm in diameter, or between 30mm to 40mm. However, significantly larger or smaller diameters may be used, depending on the type of seeds or spores. The one or more receptacles (14) may be recesses, holes or cavities in the heat transfer body (12). For example, the receptacles may be one or more recesses, holes or cavities provided in the upper surface (24) of the heat transfer body. It will be appreciated that many other configurations are possible, and the receptacles need not necessarily be recesses in the upper surface of the heat transfer body. Other types of receptacles may be implemented, for example separate receptacles may be attachable to the heat transfer body, or the receptacles may extend outwardly from the upper surface of the heat transfer body. Each of the one or more receptacles (14) may be arranged to receive one or more pads (30) therein. Each receptacle (14) may act as a cradle for a respective one of the seeds (16) or spores. The receptacles (14) may be similar to one another. The pad (30) or padding may for example be wetted prior to insertion into a receptacle (14), to facilitate germination. The pad (30) may be a cotton or fabric pad for protecting the seed (16) or spore during germination. As shown in Figure 3, optionally, the pad or padding (30) may include first and second pads (30.1, 30.2) which may be used for each seed (16) or spore, so as to cover and protect the seed (16) or spore inside the receptacle (14) during germination. Each pad (30) or padding may be shaped and configured to fit snugly inside a respective one of the receptacles (14). Optionally the padding (14) may be in contact with an inner surface of each receptacle (14), so as to promote heat transfer from the heat transfer body (12) to the seed (16) or spore. The germination device (10) may also include a removable lid (32). The lid (32) may be shaped to, at least partially, close the one or more receptacles (14) after the seeds (16) or spores are placed therein. The lid (32) may further be configured to, at least partially, contain heated or cooled air inside the germination device (10) during germination. The lid (32) may be complementarily shaped to the heat transfer body (12) of the germination device (10). In the example embodiment shown in Figures 1 to 5, the germination device (10) is generally rectangular, and the lid (32) may also have a generally rectangular shape. However, it will be appreciated that many other shapes or configurations are possible. The lid itself may also be heated or cooled by the heating or cooling element, or by virtue of physical contact with the heat transfer body. The planar or generally flat shape or flat profile of the heat transfer body (12) and/or lid (32) may be advantageous since it can enable the device to take up less space than known devices and this shape may also facilitate heat transfer to the receptacles (14). In use, the seeds (16) or spores may be placed inside the pads (30) and the seeds with their respective pads may be inserted into the receptacles (14). The wetted pads may facilitate germination, and the lid (32) may for example be closed during the initial germination, so that accurate temperature control may be achieved. The temperature control component (26) may regulate temperature in the heat transfer body (12) and this may cause the temperature at each of the receptacles (14) to be controlled, preferably for near-optimal germination. Different seeds or spores may germinate more easily at different temperatures, and the temperature may be varied dependant on the type of seeds. The selected temperature may be about 20 °C, or between 15 °C to 25 °C (i.e. more or less room temperature in some countries). Other selected temperatures may be implemented, depending on the type of seeds or spores to be germinated. For example, the selected temperature may be about 0 °C or between -5 °C to 5 °C for seeds or spores that require relatively cold temperatures to germinate. Alternatively, the selected temperature may be about 28 °C or between 20 °C to 35°C or even more than 35°C for seeds or spores that require relatively warmer temperatures to germinate. The selected temperature may be a temperature selected between -5 °C to 35 °C. The selected temperature may be selected, and the germination device (10) may be arranged to maintain or control the receptacles (14) at or near the selected temperature, depending on the type of climate in which the seeds or spores would have naturally germinated in nature. A near-optimal selected temperature may be used, which may be customized for a selected type of seed (16) or spore to be germinated by the germination device (10). It will be appreciated that the pads (30) are optional, and embodiments are possible wherein the pads may be omitted. The germination device (10) may further include insulation. The insulation may for example be provided around the outer periphery of the heat transfer body (12), or the lid (32) may be insulated, so as to contain heat inside the germination device (10) during germination of the one or more seeds (16) or spores. At least some of the grooves (20) may extend to an exterior of the device (10) with the lid (32) in place (e.g. on top of the heat transfer body (12)), so as to enable air to circulate towards or from the receptacles (14) with the seeds or spores therein. Referring to Figure 5, in the present embodiment of the germination device (10), the temperature controlling element (18) may be an electric temperature controlling element to provide heating or cooling. In other words, the cooling element may be an electric cooling element and the heating element may be an electric heating element. The temperature controlling element (18) may be arranged to be connected to a power source (34) to heat the electric heating element, or to cool the electric cooling element, as the case may be. The heating element may be configured to supply heat to the heat transfer body (12) of the germination device (10). The heat may for example be provided by conduction as the heating element is electrically heated by electric energy supplied by the power source (34) (i.e. resistance heating). For electric heating, a relatively low power may be used. For example, the power source may be arranged to provide about 5 Volts to the heating element of the temperature controlling element (18). An associated battery may be used as power source (34), or alternatively an external power source may be provided. For example, a Universal Serial Bus (USB) interface may be provided for the germination device (10), and electric power may be supplied to the heating element by way of the USB interface. Other arrangements that do not use a USB interface are also possible, and the heating element may simply be connected to an external power source such as an electric cable that leads to a plug, socket, or battery (as the case may be). A transformer may be used if necessary, depending on the type of power source used, and the power requirements of the heating element (and the particular type of seeds or spores to be germinated). The cooling element may have similar power requirements to the heating element, or it may have different power requirements. Embodiments of the present disclosure are possible wherein only heating element(s) are provided by the temperature controlling element (18), or wherein only cooling element(s) are provided by the temperature controlling element (18). However, embodiments are also possible wherein the temperature controlling element (18) may include both heating and cooling elements that may be arranged to heat or cool the body (12) as needed. Referring again to Figure 5, in the present exemplary embodiment, an internal battery may be provided as power source (34), for example inside a cavity (36) in a lower surface (38) the heat transfer body (12). The cavity (36) or housing may be provided with a closure (40). The cavity (36) or housing may also contain other components, for example electrical components of the temperature control component (26). Some of the features of the temperature control component (26) are shown diagrammatically by broken lines in Figure 5. Further features of an example embodiment of the temperature control component (26) are shown in Figure 9 which is described in more detail below. The temperature controlling element (18) may also be provided in the cavity (36), however embodiments are possible wherein the temperature controlling element (18) (including the heating element or cooling element) may be embedded inside the heat transfer body (12), or wherein the temperature controlling element (18) is spread out over a section of the heat transfer body (12), for example across the lower surface (38) or inside the body, but spread out over the width or length of the body (12). The temperature controlling element (18) may be shaped or arranged so as to facilitate substantially uniform heat conduction, or heat migration throughout the heat transfer body (12), or uniform cooling throughout the heat transfer body (12). For example, the heating element, or cooling element, may be coiled, looped or spread out throughout an area or section of the heat transfer body. It may also be possible for a plurality of heating elements or cooling elements to be used, and each heating element or cooling element may be provided near each of the receptacles (14) so as to provide substantially uniform heating or cooling to the seeds (16) or spores. It may also be possible for a cooling element to be provided, for example to provide electric cooling to the heat transfer body (12). For example, some seeds or spores may germinate near-optimally at temperatures lower than room temperature, and the cooling element may be arranged to cool one or more of the receptacles (14) in such a scenario. A thermoelectric cooling element (such as a Peltier diode, or other type of electric cooling element) may for example be used. The heat transfer body (12) and the plurality of grooves (20) or depressions, and the plurality of protrusions (22) or ridges may be arranged to conduct heat from the heating element (18) to the one or more receptacles (14). The heat transfer body (12) and the plurality of grooves (20) or depressions, and the plurality of protrusions (22) or ridges may be arranged to convey cooling from the cooling element (18) to the one or more receptacles (14). The arrangement may be such that heating or cooling may be substantially uniformly provided to each of the receptacles (14). The temperature control component (26) of the germination device (10) is shown in Figures 5 and 9. The temperature control component (26) may include a processor (44) for executing the functions of components described, which may be provided by hardware or by software units executing on the temperature control component (26). The software units may be stored in a memory component (46) and instructions may be provided to the processor (44) to carry out the functionality of the described components. A user device such as a mobile device may be in data communication with the temperature control component (26). The temperature control component may further include a transmitting component (48) and a receiving component (50). The temperature control component (26) may be arranged to provide power from the power source (34) to the temperature controlling element (18), so as to heat or cool the heat transfer body (12) and receptacles (14) to or near the selected temperature. As described herein, the temperature control element (18) may include one or more heating and/or one or more cooling elements. These heating or cooling elements may be in thermal communication with the heat transfer body (12) and/or they may be attached to, or embedded in the body (12) of the germination device (10). The selected temperature may be preselected, or selected in advance. Multiple temperatures may be selectable, or the temperature may be automatically adjusted over time by the temperature control component (26). The selected temperature may be adjustable, for example to accommodate different types of seeds or spores. Adjustment of the selected temperature may be achieved by receiving a user input as is diagrammatically illustrated by a dial (42) in Figures 5 and 9. A temperature adjustment switch or dial may be provided on the germination device (10) for example. However, it will be appreciated that this adjustment may be achieved in many ways, and a physical dial, slider or switch may be used, but such a physical adjustment device is not necessarily needed. Adjustment of the selected temperature may even be performed remotely, for example by a user device, over a wireless communications interface with the temperature control component (e.g. using a user^s smartphone in data communication with the temperature control component (26)). A mobile application may be downloadable and installable on a user device to facilitate some or all of the features of the present disclosure. In embodiments of the present disclosure, the temperature control component (26) may optionally include, or be connected to a temperature sensor (52) arranged to sense temperature in the heat transfer body (12), or at one or more of the receptacles (14). A temperature sensor component (54) of the temperature control component (26) may be arranged to receive temperature feedback from the temperature sensor (52). The temperature control component (26) may be arranged to receive the temperature feedback, and to regulate the temperature of the heat transfer body (12) (and/or that of the receptacles) at or near the selected temperature. The temperature control component (26) may also be arranged to control the selected temperature automatically. The selected temperature may be dynamically controlled, for example relative to the time of day, or the time of year. A timing component (56) or timer may be provided for this purpose, among others. The timing component (56) may for example be arranged to time a duration of time that the seeds (16) or spores are inside the receptacles (14). A user may for example press an initiation button, "on" switch, or the like to initiate or start the germination process and to power on the germination device (as well as the temperature control element (18), i.e. the heating element and/or cooling element). The timing component (56) may start timing the duration of time that the seeds (16) or spores are located inside the receptacles (14). The temperature control component (26) of the germination device (10) may for example be arranged to adjust the selected temperature relative to an amount of time since placement of the one or more seeds (16) or spores in the receptacles (14). In other words, the temperature control component may adjust or vary temperature of the heat transfer body (12) and/or that of the receptacles (14), dependant on a number of days, hours or minutes that the seeds (16) or spores are located in the receptacles (14). The germination device (10) may also include a user interface to notify a user of the duration of time that the seeds or spores are in the receptacles, for example to notify a user when to remove the lid (32). This duration of time may be selected or predefined dependant on the type of seeds or spores, i.e. dependant on the time it takes for the relevant seed or spore to germinate. Once the seeds have germinated, the user may remove the lid (32) to reveal the plants, fungi, or organisms grown from the seeds or spores. Further steps may be taken for propagation or further features of the present disclosure may be implemented, as will be described below with reference to Figures 6 to 8. The heat sink body or heat transfer body (12) may be made from a material suited to conduct or convey heat. It will be appreciated that the body (12) of the germination device may be referred to as a heat sink body, a sink, or a heat transfer body (12), however, the body (12) may be arranged to conduct heat to the receptacles (14), or to convey or conduct heat away from the receptacles (14) (i.e. when implementing the cooling element of the temperature control element (18)). The cooling element may be a dedicated cooling device connected to the heat transfer body such as a Peltier diode or another type of cooling device or electric element that may provide active cooling. Alternatively, or in addition, the cooling element may simply be air or fluid which circulates between the fins or protrusions (22) of the heat transfer body (12). E.g. if the room temperature is about 25°C, and the selected temperature is also 25°C (i.e. the seeds or spores may need to be kept at about 25°C to properly germinate), then the cooling element may simply be air that circulates between the protrusions or ridges to cool the receptacles (14) to room temperature. If, however, room temperature rises above 25°C (or if temperature in the receptacles rises above 25°C for some reason), then an active cooling element such as an electric cooling element may be implemented by the temperature control component (26), so as to cool the receptacle(s) (14) down to the selected temperature (25°C in this example case). The temperature sensor (52) may measure temperature in the body (12) or in the receptacles (14) in near real-time, so that temperature feedback may be used by the temperature control component (26) to either provide cooling or heating, as needed. Naturally, other selected temperatures or germination temperatures may be implemented. Some seeds may for example germinate close to freezing or even below 0°C, and the cooling element may be arranged to provide cooling of receptacles to temperatures below 0°C if needed. In such a case, the padding (30) may for example be replaced by soil. Soil and/or fertilizer may also replace the padding (30) in other cases, for germination above 0°C, depending on the type of seeds or spores. The material of the heat transfer body (12) may be a metal selected from the group consisting of aluminium, copper, iron and steel. The material of the heat transfer body may be an alloy, such as an aluminium alloy or brass or other alloys. Alternatively, non-metallic materials, metalloids, composites, or a combination of materials may be used to make the heat transfer body (12) or heat sink body. The material of the heat transfer body (12) may be selected so as to be corrosion resistant. Alternatively, the heat transfer body (12) may be treated with a corrosion resistant agent or substance. In particular, the material of the receptacles (14) may be selected so as to be corrosion resistant, or the receptacles or their inner surfaces may be treated with the corrosion resistant agent or substance. The heat transfer body (12) may be reusable, and the corrosion resistance of the heat transfer body may facilitate reuse thereof. Turning now to Figures 6 to 8, The heat transfer body (12) of the germination device (10) may be configured to be used with a propagator (58), or the germination device (10) may include a propagator (58). In other words, embodiments are possible wherein the germination device (10) may include the propagator, or the germination device may be used separately, and a propagation device or propagator may be attached to the germination device to promote further growth of the plants or organisms germinated by the germination device. The propagator (58) may include a holder (60) or frame structure having one or more holes (62) or holding formations for holding compressed matter (64) or other material for the seeds (16) or spores to grow in or through. Examples of seeds (16) are shown in Figure 3, but it will be appreciated that the process may be similar for spores, and the germination device (10) with seeds (16) or spores may be used with the compressed matter (64) shown in Figures 7-8, for example after the seeds or spores have germinated, or after they have grown to a first stage. Further stage(s) of growth may be facilitated by the propagator (58) or propagation device. The compressed matter (64) may for example be compressed soil, compost, fertiliser, organic material, combinations of these, or the like. The compressed matter may be shaped as pellets (64) that may be receivable inside the holes (62) or holding formations in the holder (60) of the propagator (58), for example as shown in the exploded view in Figure 8. In the present embodiment, the heat transfer body (12) includes ten receptacles (14) for ten seeds (16) or spores, and the holder (60) of the propagator (58) may be arranged to accommodate ten pellets (64) to correspond to the ten receptacles (14). However, it will be appreciated that any number of receptacles, seeds, pellets and corresponding holes in the holder may be implemented in various embodiments. For example, another embodiment (1000) having twelve receptacles is described below with reference to Figures 11 to 14. The propagator (58) may include a cover (68) which may optionally be transparent or translucent. The cover (68) may be arranged to fit on or over the holder (60), and the cover (68) may be at least partially fluid tight. The transparency or translucency of the cover (68) may enable light to pass therethrough, so as to provide light to plants, fungi or organisms grown from the seeds (16) or spores inside the germination device (10). The cover (68) may further be shaped so as to substantially contain water vapour therein, or at least to partially contain humid air or water vapour therein. A humidity regulator (70) or adjustable vent may be provided for regulating or controlling the humidity inside the cover (68) of the propagator (58). The humidity regulator or adjustable vent (70) may for example have a plurality of openings (72) therein, and these openings may have different sizes, so as to enable a quantity of humid air to exit an interior of the cover (68), said quantity of air depending on the size of the opening (72) or hole that is selected by a user of the germination device (10). The humidity regulator (70) may for example be adjusted by rotating the openings (72), so as to align one of the openings (72) having a selected size with an opening in the cover (68). The germination device (10) may be arranged to have the propagator (58) installed thereon, to facilitate propagation of each plant, fungus or organism grown from the respective seeds or spores. Optionally, an electric light source may be provided to provide light to the plants, fungi, or organisms grown, or otherwise natural light may be used. The heat transfer body (12) of the germination device (10) may be manufactured in various ways, for example the upper surface (24) thereof (including the grooves, protrusions, and the receptacles) may be milled, drilled, or machined in another way. Additive manufacturing or other manufacturing techniques may also be used. In Figure 10 there is shown a high-level flow diagram of an exemplary germination method (100). The method (100) may include providing (110) a heat transfer body having one or more receptacles for operatively receiving seeds or spores therein. The method (100) may further include, by a temperature controlling element, enabling (112) the receptacles of the body to be heated or cooled to a selected temperature. The method may further include facilitating (114) germination of seeds or spores in the receptacles in use. It will be appreciated that embodiments are possible wherein the germination device of Figures 1 to 5 may be used on its own, or embodiments are possible wherein the germination device includes the propagator shown in Figures 6 to 8. For example, the lid may be omitted, or replaced with the holder, and the seedlings may simply grow through the pellets in the holder. It will also be appreciated that the germination device may be used to germinate seeds or spores, but the germination device may also be used to facilitate growth of young plants, fungi or organisms, for example plants that are grown from a cutting instead of ones grown from a seed. After the seeds or spores have germinated inside the receptacles, they may be removed and placed inside the pellet(s) to grow therein or therethrough (for example underneath the cover or dome of the propagator). Another embodiment of a germination device (1000) is shown in Figures 11 to 14. One or more features of the present embodiment may be similar to the embodiments described with reference to Figures 1 to 10, or the germination device (1000) may include features from the embodiments described with reference to Figures 1 to 10. The embodiments of Figures 1 to 10 may also include one or more features of the embodiment described with reference to Figures 11 to 14. Like reference numerals may be used to indicate similar features. The germination device (1000) may be similar to the germination device (10) described above. The germination device (1000) may include a propagator (1058) and holder (1060) similar to the propagator (58) and holder (60) described above. This embodiment may have twelve receptacles (1014) but it may otherwise be similar to the embodiment (10) described above. The holder (1060) may be shaped to fit a removable lid (1032) of the germination device (1000). As before, the lid (1032) may at least partially close a heat transfer body (1012) and its receptacles (1014). The heat transfer body (1012) and lid (1032) may be made of a metal such as aluminium, copper, brass, alloys, or another thermally conductive material (as described above with reference to the heat transfer body (12)). The holder (1060) (also referred to as a spacer) may be attached to the lid (1032) by a snap-fit, or by a magnetic attachment so as to facilitate easy removal of the holder from the lid and so as to make it easy to fit the holder to the lid. A bottom edge of the holder (1060) may have a plurality of slots therein, for example to align with grooves (1020) in the heat transfer body (1012). The lid may for example be omitted in some implementations, but with or without the lid, these slots (1011) may enable circulation of air into the holder (1060) and/or into or out of the germination device (1000). As with the other embodiments, the heat transfer body (1012) may also include protrusions (1022), e.g. in the top surface of the body (1012). The base or heat transfer body (1012) may be used to germinate seeds or spores as described herein, and this may be done while the holder and/or while a cover (1068) or dome of the propagator (1058) is placed on top of the lid (1032) as shown in the assembled view in Figure 14. An advantage of the fitting between the holder and lid, or between the holder and the heat transfer body, as the case may be, is that the heating or cooling of the heat transfer body and lid may be transferred to the pellets (1064) or compressed matter or other growing medium in the holder (1060). This may enable simultaneous germination and propagation. During use, for example, a user may place seeds or spores in the receptacles, and periodically remove the lid to check if any of the seeds or spores have germinated. The user may place one or more of the germinated plants or organisms into the pellet(s) (1064) to enable them to propagate inside the cover (1068). This may provide a better user experience than known devices or methods. The heating or cooling (as the case may be) of the heat transfer body may also serve to heat or cool the pellets (1064) (for example because the pellets are resting on top of the lid (1032) which also receives at least some of the heating or cooling from the heat transfer body (1012)). This may facilitate growth of the organism, plant, or fungus inside the propagator (1058). As before, a humidity regulator (1070) or adjustable vent may be provided on the cover (1068). Figure 13 shows an optional closure (1040) for electrical components of the germination device (1000), while Figure 14 shows the components of the germination device (1000) assembled to one another. The propagator, holder and cover may be referred to as a kit or expansion kit for use with the germination device, or all the components of the germination device may be made available as a kit. The germination device including the heat transfer body (1012) and lid (1032) may be sold separately, and the propagator may be sold as an expansion to the device or system. The present disclosure may provide the advantage that heating or cooling may be more efficiently controlled in each of the receptacles than with known devices or methods, so that more efficient growth of the plants, fungi or organisms may be promoted. The present disclosure may also provide the advantage that the power supply needed may be relatively low. This may inhibit a user from burning themselves accidentally, or it may inhibit the device from overheating and causing a fire or other damage. The battery used, and the various components of the germination device may also be relatively inexpensive to manufacture and heat transfer of the heat transfer body may be more efficient than with known devices or methods, so as to control temperature more accurately by the temperature control component. The present disclosure may provide a portable and expandable electronic multi temperature seed germinator or seedling propagator. The present disclosure may provide a seed germination device which may allow users to create a thermostatic environment for seeds or spores to germinate. The germination device may be easy to use, and it may be affordable. The germination device (and/or propagator) may provide enough natural or ambient light and fresh air exchange for a seed to germinate more easily and effectively than with known methods or devices. The heat transfer body and its plurality of grooves, depressions, protrusions, or ridges may enable air to circulate from an exterior of the device towards the seeds or spores in the receptacles. Once the seed (or spore) has germinated or began to grow, the user may be provided with the functionality and/or the ability to expand the germinator into a thermostatic seedling propagator with humidity control. The foregoing description has been presented for the purpose of illustration; it is not intended to be exhaustive or to limit the invention to the precise forms disclosed. Persons skilled in the relevant art can appreciate that many modifications and variations are possible in light of the above disclosure. The language used in the specification has been principally selected for readability and instructional purposes, and it may not have been selected to delineate or circumscribe the inventive subject matter. It is therefore intended that the scope of the invention be limited not by this detailed description, but rather by any claims that issue on an application based hereon. Accordingly, the disclosure of the embodiments of the invention is intended to be illustrative, but not limiting, of the scope of the invention, which is set forth in the following claims. Finally, throughout the specification and accompanying claims, unless the context requires otherwise, the word "comprise " or variations such as "comprises" or "comprising" will be understood to imply the inclusion of a stated integer or group of integers but not the exclusion of any other integer or group of integers.