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Title:
GLASS SUBSTRATE, GLASS PLATE PRECURSOR IN WHICH THROUGH-HOLES ARE TO BE FORMED, AND METHOD FOR MANUFACTURING GLASS SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2022/196019
Kind Code:
A1
Abstract:
A glass substrate according to the present invention has through-holes therein, the glass substrate being characterized in that, when the HF etching rate of the glass substrate is defined as ER and the HF etching rate of the glass substrate after the glass substrate is subjected to a heat treatment is defined as ERa, the ER/ERa value is 1.50 or less.

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Inventors:
MAKIKTA MASAKI (JP)
Application Number:
PCT/JP2021/047908
Publication Date:
September 22, 2022
Filing Date:
December 23, 2021
Export Citation:
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Assignee:
NIPPON ELECTRIC GLASS CO (JP)
International Classes:
C03C15/00; C03C23/00; G09F9/30; H05K1/03; H05K3/00
Foreign References:
JP2019089082A2019-06-13
JP2013537723A2013-10-03
JP2019055888A2019-04-11
JP2019530629A2019-10-24
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