Title:
GLASS SUBSTRATE WITH MODIFIED LAYER AND GLASS SUBSTRATE WITH WIRING CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2016/140188
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a method for improving, in a glass substrate with a wiring circuit, adhesion between the wiring circuit and the glass substrate. To this end, a glass substrate with a modified layer to be used for obtaining the glass substrate with the wiring circuit is employed, the glass substrate with the modified layer being characterized by comprising a porous ceramic film or a porous glass film having a thickness of 20 to 100 nm as the modified layer on a surface of the glass substrate. Also employed are a glass substrate with a metal conductive layer and a glass substrate with the wiring circuit which are characterized by comprising a conductive metal layer on a surface of the modified layer of the glass substrate with the modified layer.
Inventors:
OKABE KYOHEI (JP)
CORDONIER CHRISTOPHER (JP)
NOH JOO-HYONG (JP)
HONMA HIDEO (JP)
TAKAI OSAMU (JP)
CORDONIER CHRISTOPHER (JP)
NOH JOO-HYONG (JP)
HONMA HIDEO (JP)
TAKAI OSAMU (JP)
Application Number:
PCT/JP2016/056049
Publication Date:
September 09, 2016
Filing Date:
February 29, 2016
Export Citation:
Assignee:
KANTO GAKUIN SCHOOL CORP (JP)
International Classes:
C03C17/25; C03C17/02; C03C17/36; H05K3/38
Foreign References:
| JP2001032086A | 2001-02-06 | |||
| JP2002129347A | 2002-05-09 | |||
| JP2007126743A | 2007-05-24 | |||
| JP2009024203A | 2009-02-05 | |||
| JP2014216541A | 2014-11-17 | |||
| JPH01317135A | 1989-12-21 |
Other References:
KYOHEI OKABE ET AL.: "Sol-Gel-ho o Mochiita Glass Kibanjo eno Mudenkai Do Mekki", THE SURFACE FINISHING SOCIETY OF JAPAN KOEN TAIKAI KOEN YOSHISHU, 20 February 2015 (2015-02-20), pages 242
Attorney, Agent or Firm:
YOSHIMURA, KATSUHIRO (JP)
Katsuhiro Yoshimura (JP)
Katsuhiro Yoshimura (JP)
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