GRAVURE CYLINDER-USE COPPER PLATING METHOD AND DEVICE

WIPO Patent Application WO/2006/126518

A1

Gravure cylinder-use copper plating method and device which can perform a uniform-thickness copper plating on a gravure cylinder over its entire length without causing defects such as rashes and pits regardless of the size of a gravure cylinder, can automatically control the concentration of copper plating solution, reduce the consumption of an additive, enable a short-time plating treatment, reduce power supply costs, and are easy to handle with good visibility. A hollow cylindrical gravure cylinder is gripped at the opposite longitudinal-direction ends, is placed in a plating tank filled with copper plating solution, and is energized so as to function as a cathode while rotated at a specified speed; a pair of long-box anode chambers that are vertically suspended slidably on the opposite sides of the gravure cylinder in the plating tank and incorporate insoluble anodes so energized as to function as anodes are allowed to come close to the opposite side surfaces of the gravure cylinder with specified intervals; and the outer peripheral surface of the gravure cylinder is copper plated.

INOUE MANABU (JP)
MATSUMOTO NORIKO (JP)

PCT/JP2006/310209

November 30, 2006

May 23, 2006

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THINK LABS KK (JP)
INOUE MANABU (JP)
MATSUMOTO NORIKO (JP)

C25D17/00; B41N3/03; C25D7/04; C25D21/14

JP2005029876A	2005-02-03
JP2004269955A	2004-09-30
JP2000017495A	2000-01-18
JPH08193299A	1996-07-30
JPS6360295A	1988-03-16

Ishihara, Shoji c/o Ishihara International Patent Firm (No. 302 Wakai Bldg., 7-8, Higashi-Ikebukuro 3-chom, Toshima-ku Tokyo 13, JP)

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