GREASE

WIPO Patent Application WO/2008/047809

A1

It is intended to provide a grease which shows a low heat resistance and has been improved in degradation due to heat cycle, in particular, a grease which is suitable for a heat-conductive material of a heat-generating electronic component. A grease comprising a heat-conductive material powder made up of one or more members selected from the group consisting of a heat-conductive material (A), a heat-conductive material (B) and a heat-conductive (C), in which the heat-conductive material powder has frequency peaks within the ranges of 2.0 to 10 μm, 1.0 to 1.9 μm and 0.1 to 0.9 μm in the grain size distribution determined by the laser diffraction grain size distribution method and which contains a base oil having a surface tension at 25oC of from 25 to 40 dyn/cm.

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YAMAGATA TOSHITAKA (JP)
OKADA TAKUYA (JP)
UBUKATA AKIRA (JP)

PCT/JP2007/070200

April 24, 2008

October 16, 2007

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DENKI KAGAKU KOGYO KK (JP)
YAMAGATA TOSHITAKA (JP)
OKADA TAKUYA (JP)
UBUKATA AKIRA (JP)

C10M169/02; C10M107/50; C10M125/04; C10M125/10; C10M125/20; C10M139/04; C10N10/04; C10N10/06; C10N20/00; C10N20/02; C10N20/06; C10N30/08; C10N40/14; C10N50/10

JP2005330426A	2005-12-02
JP2005054099A	2005-03-03
JP2001152175A	2001-06-05
JP2000169873A	2000-06-20
JP2002201483A	2002-07-19
JP2004091743A	2004-03-25
JP2005170971A	2005-06-30
JP2005154532A	2005-06-16

SENMYO, Kenji et al. (SIA Kanda Square17, Kanda-konyacho,Chiyoda-k, Tokyo 35, JP)

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