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Title:
GRINDING APPARATUS AND METHOD FOR CONTROLLING GRINDING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2013/187164
Kind Code:
A1
Abstract:
The present invention simplifies the structure of a grinding apparatus, and enabling the grinding apparatus to be manufactured at low cost. The grinding apparatus (1) is provided with a moving section (13) for moving a grinding object holding section, and a controller (3) for controlling the moving section (13). The controller (3) performs grinding by making the grinding object holding section (10) move toward a grinding section (20) using the moving section (13). When the controller (3) moves the grinding object holding section (10) using the moving section (13) before and after grinding by means of the grinding section (20) to a prescribed reference position (RP), which is established on the movement axis (O1) of the grinding object holding section (10), and the surface being held (14) by the grinding object holding section (10) is ground by the grinding section (20) such that the thickness is reduced, the grinding object holding section (10) is moved in such a manner as to compensate for said reduction, so as to be positioned at the prescribed reference position (RP). The structures of a conveying device (40) and a chuck cleaner (50) can thus be simplified.

Inventors:
YAMAZAKI JUNICHI (JP)
KODAMA YOUICHI (JP)
Application Number:
PCT/JP2013/063335
Publication Date:
December 19, 2013
Filing Date:
May 13, 2013
Export Citation:
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Assignee:
KOMATSU NTC LTD (JP)
International Classes:
B24B47/16; B24B7/04
Domestic Patent References:
WO2009066628A12009-05-28
Foreign References:
JP2000153456A2000-06-06
JP2003291063A2003-10-14
JP2008087104A2008-04-17
JPH01289661A1989-11-21
JP2002093762A2002-03-29
JP2007276093A2007-10-25
Attorney, Agent or Firm:
WILLFORT INTERNATIONAL (JP)
Patent business corporation Wil photograph international patent firm (JP)
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