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Patent Searching and Data


Title:
GRINDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/063166
Kind Code:
A1
Abstract:
Provided is a grinding device whereby the position of a workpiece surface to be processed can be efficiently and precisely measured without advance preparation such as NC program creation. The present invention has a workpiece table (14) for holding a workpiece (W), a grinding wheel (10) for grinding the workpiece (W) while rotating, and a detection sensor (20) for contacting a workpiece (W) surface to be processed and detecting the position of the surface to be processed, the relative positions of the detection sensor (20) and the workpiece table (14) are changed by a manual operation, the detection sensor (20) is brought into contact with the workpiece (W), and measurement of the workpiece (W) is performed. Through this configuration, advance preparation such as creation of an NC program for measurement, initial setting, and operation confirmation can be omitted, and highly efficient measurement with greatly reduced time for advance preparation can be performed. Workpiece (W) yield using the grinding device (1) can thereby be enhanced.

Inventors:
WATANABE TETSUYUKI (JP)
TSUCHIYA KEIJI (JP)
Application Number:
PCT/JP2022/037113
Publication Date:
April 20, 2023
Filing Date:
October 04, 2022
Export Citation:
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Assignee:
OKAMOTO MACHINE TOOL WORKS (JP)
International Classes:
B24B49/02; B24B7/02
Domestic Patent References:
WO2010007685A12010-01-21
Foreign References:
JP2020110893A2020-07-27
JPH0938859A1997-02-10
JP2021030377A2021-03-01
JP2018149621A2018-09-27
JP2011131320A2011-07-07
Attorney, Agent or Firm:
OTAKE Masahisa (JP)
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