Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
GRINDING TAPE AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
WIPO Patent Application WO/1994/027787
Kind Code:
A1
Abstract:
In order to manufacture a grinding tape (11) which consists of a film substrate (2) and a grinding layer (10) laminated on one surface thereof, and which has a plurality of recesses (9) in the surface of the grinding layer (10), a film substrate (2) is wound partially around the circumferential surface of a roll intaglio (1) provided with a plurality of recesses (5) in the surface thereof, and the film substrate (2) is fed as the roll intaglio (1) is rotated. In the meantime, an ionizing radiation setting resin (3) is fed between the roll intaglio (1) and the film substrate (2) passed therearound, in such a manner that the resin (3) is shaped by the recesses (5) to cause recesses (9) to be formed in the surface of the resin (3). During the shaping of the resin (3), the radiation R is applied from an ionizing radiation source (8) to the resin (3) so as to harden the resin (3) and combine the resin (3) and film substrate (2) with each other unitarily. A grinding tape (11) thus obtained is peeled off from the roll intaglio (1). This grinding tape (11) is of a high quality. The method of manufacturing such grinding tapes has a high efficiency, and is suitable for the mass-production of grinding tapes having the same recesses and projections on the surfaces thereof.

Inventors:
NISHIO TOSHIKAZU (JP)
AMEMIYA HIROYUKI (JP)
NAKAI YASUO (JP)
ISHII TAIJI (JP)
YAMAGUCHI MASAHISA (JP)
Application Number:
PCT/JP1993/000743
Publication Date:
December 08, 1994
Filing Date:
June 02, 1993
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DAINIPPON PRINTING CO LTD (JP)
NISHIO TOSHIKAZU (JP)
AMEMIYA HIROYUKI (JP)
NAKAI YASUO (JP)
ISHII TAIJI (JP)
YAMAGUCHI MASAHISA (JP)
International Classes:
B24D3/28; H04L27/00; B24D11/00; H03H15/00; H03H17/00; H03H21/00; H03M13/23; H03M13/41; H04B1/10; H04B3/04; H04B7/005; H04L1/00; H04L7/00; H04L25/03; (IPC1-7): B24D11/00
Foreign References:
JPH0283172A1990-03-23
JPH01149263U1989-10-16
JPH02256467A1990-10-17
JPH01171771A1989-07-06
Other References:
See also references of EP 0664187A4
Download PDF: