Title:
GROOVE PROCESSING DEVICE AND GROOVE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/230816
Kind Code:
A1
Abstract:
This groove processing device, which forms a groove in the surface of an object by means of a laser beam (LB), comprises: a light source device (11) that outputs the laser beam (LB); a polygon mirror (10) that reflects the laser beam (LB) output from the light source device (11); a focusing optical system that is provided on an optical path of the laser beam (LB) reflected by the polygon mirror (11) and focuses the laser beam (LB); and a shielding plate (35) that is provided at a position where a portion of the laser beam (LB) focused through the focusing optical system is shielded between the focusing optical system and the object, and shields the portion of the laser beam (LB), wherein a portion of the laser beam (LB) not shielded by the shielding plate (35) among the laser beam (LB) focused through the focusing optical system forms the groove in the surface of the object at a focal point of the laser beam (LB), and the shielding plate (35) is provided closer to the focusing optical system than the focal point, and rotates with respect to the surface of the object to shield the laser beam (LB) that does not form the groove.
Inventors:
HAMAMURA HIDEYUKI (JP)
Application Number:
PCT/JP2020/019105
Publication Date:
November 19, 2020
Filing Date:
May 13, 2020
Export Citation:
Assignee:
NIPPON STEEL CORP (JP)
International Classes:
B23K26/364; B23K26/066; B23K26/082; G02B26/12
Foreign References:
| JP2014161899A | 2014-09-08 | |||
| JP2002028798A | 2002-01-29 | |||
| JP2019091043A | 2019-06-13 | |||
| JP2002292484A | 2002-10-08 |
Other References:
See also references of EP 3970903A4
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
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