GROUND CONNECTION WITHDRAWING FILM

WIPO Patent Application WO/2021/177261

A1

Provided is a ground connection withdrawing film in which separation is not liable to occur between a metal layer and an adhesive layer and gas is not liable to be accumulated between the metal layer and the adhesive layer during heating, or a ground connection withdrawing film that enables formation thereof. A ground connection withdrawing film 1 is provided with: a metal layer 2; and an adhesive layer 3 provided on one surface 2b of the metal layer 2. In the metal layer 2, an opening part 21 penetrating in a thickness direction T is formed. The opening part 21 has, as a cross section in the thickness direction T, a cross section having a first width D1 that extends in a plane spreading direction H and is relatively wide and a second width D2 that extends in the plane spreading direction H and is relatively narrow with respective to the first width D1. The adhesive layer 3 is laminated on the surface of the metal layer 2 on the side of the second width D2 with respect to the first width D1. A part of the adhesive layer 3 is capable of entering or enters the opening part 21. In a state where a part of the adhesive layer 3 enters the opening part 21, the second width D2 is buried in the adhesive layer inside the opening part 21.

HARUNA YUUSUKE (JP)

PCT/JP2021/007804

September 10, 2021

March 02, 2021

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TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)

B32B15/08; H05K9/00

WO2014192494A1	2014-12-04
WO2018147298A1	2018-08-16

EP3554204A1	2019-10-16
JP2009176761A	2009-08-06
JP2012180583A	2012-09-20
JPH08209726A	1996-08-13

GOTO & CO. (JP)

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