Title:
GROUND MEMBER AND SHIELDED PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2020/116409
Kind Code:
A1
Abstract:
The present invention provides a ground member which is able to be prevented from breakage of the interlayer adhesion between a conductive layer and an adhesive layer of the ground member due to heating during the production of a shielded printed wiring board or during mounting of an electronic component on the shielded printed wiring board. A ground member according to the present invention comprises a conductive layer and an adhesive layer that is superposed on the conductive layer, and is characterized in that: the adhesive layer contains a binder component and hard particles; and the thickness of the adhesive layer is 5-30 μm.
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Inventors:
AOYAGI YOSHIHIKO (JP)
KAMINO KENJI (JP)
HARUNA YUUSUKE (JP)
KAMINO KENJI (JP)
HARUNA YUUSUKE (JP)
Application Number:
PCT/JP2019/047104
Publication Date:
June 11, 2020
Filing Date:
December 03, 2019
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
H05K9/00; H05K1/02
Domestic Patent References:
| WO2014132951A1 | 2014-09-04 |
Foreign References:
| JP2018039959A | 2018-03-15 | |||
| JP2016122687A | 2016-07-07 | |||
| JP2015053412A | 2015-03-19 | |||
| US20120048603A1 | 2012-03-01 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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