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Patent Searching and Data


Title:
GROUND PRODUCT MANUFACTURING APPARATUS AND GROUND PRODUCT MANUFACTURED USING THE SAME
Document Type and Number:
WIPO Patent Application WO/2006/070866
Kind Code:
A1
Abstract:
This invention provides a ground product manufacturing apparatus with high ground product manufacturing efficiency and ground product recovery efficiency and a ground product manufactured using the same. According to the ground product manufacturing apparatus and manufacturing process, high ground product manufacturing efficiency and ground product recovery efficiency can be realized by carrying out grinding and the transport of a ground product utilizing wind power. At the outset, upon the rotation of an impeller (a rotating blade) in a grinding machine (3), the inside of the grinding machine (3) is brought to a pressurized turbulent state by wind power. Further, centrifuging means (4) is operated. Next, upon the introduction of a raw material through a raw material introduction port (14), the raw material is ground with the grinding machine (3) to prepare a ground product. The ground product is fed into the centrifuging means (4) by wind power of the grinding machine (3) and the suction force of a gas suction machine (15). The ground product is collected in the inside of a collector (5) provided below the centrifuging means (4). The ground product not separated by the centrifuging means (4) is collected in the inside of the collector (5) provided below filtration collection means (6). The apparatus and manufacturing process can be properly modified.

Inventors:
MAEDA HIROSHI (JP)
YASUI MITSUO
Application Number:
PCT/JP2005/024063
Publication Date:
July 06, 2006
Filing Date:
December 28, 2005
Export Citation:
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Assignee:
MAEDA HIROSHI (JP)
YASUI MITSUO
International Classes:
B02C23/28; B02C13/08; B02C13/284; B02C21/00; B02C23/14; B02C23/34
Foreign References:
JPS63147564A1988-06-20
JPS63175644A1988-07-20
JPH0823947A1996-01-30
JP2004337660A2004-12-02
Attorney, Agent or Firm:
IKEUCHI SATO & PARTNER PATENT ATTORNEYS (OAP TOWER 8-30, Tenmabashi 1-chome, Kita-k, Osaka-shi Osaka 26, JP)
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