Title:
GROUND STRUCTURE OF SEMICONDUCTOR CHIP TEST SOCKET, AND SEMICONDUCTOR CHIP TEST SOCKET HAVING SAME
Document Type and Number:
WIPO Patent Application WO/2018/034500
Kind Code:
A1
Abstract:
The present invention relates to a ground structure of a semiconductor chip test socket, and a semiconductor chip test socket having the same, the ground structure: preventing the ground structure made of a soft material and mounted in a semiconductor chip test socket from being stuck; having structural stability so as to prevent separation from an accommodation body during cleaning or testing; and providing increased grounding function such that product reliability can be improved. According to the present invention, provided are a ground structure, which is provided in a semiconductor chip test socket so as to provide grounding, and a semiconductor chip test socket having the same, the ground structure comprising: a conductive metal layer having a plurality of coupling holes formed therein; a body layer made of a soft material, coupled to one surface of the conductive metal layer, and having a coupling part coupled to the coupling holes; and conductive powder provided in the body layer.
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Inventors:
OH JAESUK (KR)
LIM KYUNGSOOK (KR)
LIM KYUNGSOOK (KR)
Application Number:
PCT/KR2017/008934
Publication Date:
February 22, 2018
Filing Date:
August 17, 2017
Export Citation:
Assignee:
OH JAESUK (KR)
LIM KYUNGSOOK (KR)
LIM KYUNGSOOK (KR)
International Classes:
G01R1/04; G01R31/28
Foreign References:
| KR101410866B1 | 2014-06-24 | |||
| JP2000097991A | 2000-04-07 | |||
| KR101179545B1 | 2012-09-05 | |||
| JP2008108453A | 2008-05-08 | |||
| KR101108481B1 | 2012-01-31 |
Attorney, Agent or Firm:
KIM, Jeongok (KR)
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