Title:
GYPSUM BOARD MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/042922
Kind Code:
A1
Abstract:
Provided is a technology that: can effectively suppress the occurrence of wrinkling in base paper constituting a gypsum board product obtained by a gypsum board manufacturing method, by a simple method and without using chemical substances and is applicable to a continuous manufacturing process for an actual gypsum board; and can stably manufacture superior quality gypsum boards with good yield. This gypsum board manufacturing method has a step for molding a plate-shaped laminate in which a gypsum material layer is laminated between top paper and bottom paper of gypsum board base paper, while conveying the plate-shaped laminate, wherein: the step has a series of processes for arranging the bottom paper on an operating conveyance molding belt, continuously casting a gypsum slurry of the raw material of the gypsum material layer onto the bottom paper being conveyed, laminating the top paper on the gypsum slurry to mold a plate-shaped laminate with a molding machine, and conveying the plate-shaped laminate to a rough cutting machine with the conveyance molding belt; and water is sprayed or applied on the top paper at a position that is 1/4 of a position between the arrangement location of the molding machine and the arrangement location of the rough cutting machine, or at a position that is on the molding machine side upstream from the 1/4 position.
Inventors:
NIIMI KATSUMI (JP)
SATO YOSUKE (JP)
NAITO DAISUKE (JP)
SATO YOSUKE (JP)
NAITO DAISUKE (JP)
Application Number:
PCT/JP2023/026334
Publication Date:
February 29, 2024
Filing Date:
July 19, 2023
Export Citation:
Assignee:
YOSHINO GYPSUM CO (JP)
International Classes:
B28B1/30
Foreign References:
| JP2019025696A | 2019-02-21 | |||
| US20200130227A1 | 2020-04-30 | |||
| US20040065399A1 | 2004-04-08 | |||
| JPH06505448A | 1994-06-23 |
Attorney, Agent or Firm:
KONDO Rieko et al. (JP)
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