Title:
HALF BEARING
Document Type and Number:
WIPO Patent Application WO/2018/079839
Kind Code:
A1
Abstract:
A half bearing 10 has a groove 111 and a groove 112 that are provided on the inner circumferential surface 12 side so as to run in a circumferential direction of the inner circumferential surface. Among the circumferential ends of the groove 111, the one at the upstream side in the rotational direction of a shaft is positioned at a deviation angle θ1 of 135° when the deviation angle θ1 is defined to be an angle formed between a virtual line L1 that connects an inner circumferential-side end of a mating surface 16 and an original point P1 of an outer circumferential surface and a virtual line L2 that connects the position P2 of a circumferential end of the groove 111, the end being located at the upstream side in the shaft rotational direction, and the original point P1 of the outer circumferential surface. Further, among the circumferential ends of the groove 112, the end at the upstream side in the shaft rotational direction is positioned at a deviation angle θ2 of 135° when the deviation angle θ2 is defined to be an angle formed between the virtual line L1 that connects the inner circumferential-side end of the mating surface 16 and the original point P1 of the inner circumferential surface and a virtual line L3 that connects the position P3 of a circumferential end of the groove 112, the end being located at the upstream side in the shaft rotational direction, and the original point P1 of the outer circumferential surface.
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Inventors:
TAKATA HIROKI (JP)
KAJIKI YUICHIRO (JP)
KAJIKI YUICHIRO (JP)
Application Number:
PCT/JP2017/039357
Publication Date:
May 03, 2018
Filing Date:
October 31, 2017
Export Citation:
Assignee:
TAIHO KOGYO CO LTD (JP)
International Classes:
F16C33/10; F16C9/02; F16C9/04; F16C17/02
Domestic Patent References:
| WO2016136997A1 | 2016-09-01 | |||
| WO2012158749A1 | 2012-11-22 |
Foreign References:
| JP2005249024A | 2005-09-15 | |||
| JP2016033414A | 2016-03-10 |
Attorney, Agent or Firm:
ASAHI PATENT FIRM (JP)
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