Title:
HALOGEN-FREE EPOXY RESIN COMPOSITION AND PREPREG, LAMINATED BOARD AND PRINTED CIRCUIT BOARD CONTAINING SAME
Document Type and Number:
WIPO Patent Application WO/2017/092472
Kind Code:
A1
Abstract:
Provided are a halogen-free epoxy resin composition and a prepreg, a laminated board and a printed circuit board containing same, falling within the technical field of copper clad laminates. The halogen-free epoxy resin composition comprises an epoxy resin and a curing agent, and with the total equivalent number of epoxy groups of the epoxy resin being 1, the equivalent number of an active group reacting with the epoxy group in the curing agent is 0.5-0.95. By controlling the equivalent ratio of the epoxy group in the epoxy resin to the active group in the curing agent to be 0.5-0.95, the stability of a Df value of a prepreg under different curing temperature conditions is guaranteed while a low dielectric constant and a low dielectric loss are maintained. In addition, a prepreg and a laminated board prepared using the resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame resistance, heat resistance, cohesiveness, a low water absorption and an excellent moisture resistance, and are suitable for use in a halogen-free and high multilayer circuit board.
Inventors:
LI HUI (CN)
FANG KEHONG (CN)
XU YONGJING (CN)
FANG KEHONG (CN)
XU YONGJING (CN)
Application Number:
PCT/CN2016/098480
Publication Date:
June 08, 2017
Filing Date:
September 08, 2016
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
B32B15/092; C08L63/00; B32B27/38; C08G59/40; C08G59/42; C08J5/24; C08K13/02; C08L35/06; C08L79/04; H05K1/03
Foreign References:
| CN102399415A | 2012-04-04 | |||
| CN101643571A | 2010-02-10 | |||
| CN102633952A | 2012-08-15 | |||
| US9005761B2 | 2015-04-14 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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