Title:
HALOGEN-FREE FLAME-RETARDANT ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2013/133041
Kind Code:
A1
Abstract:
This halogen-free flame-retardant adhesive composition contains (A) solvent-soluble polyamide resin that is solid at 25°C, (B) phenoxy resin, (C) halogen atom-free epoxy resin, and (D) phosphorus-based flame retardant having a structure shown by general formula (1); the content of phenoxy resin (B) is 50-500 parts by mass per 100 parts by mass of polyamide resin (A); the content of epoxy resin (C) is 1-60 parts by mass per 100 total parts by mass of polyamide resin (A) and phenoxy resin (B); and the content of phosphorus-based flame retardant (D) is 5-100 parts by mass per 100 total parts by mass of polyamide resin (A) and phenoxy resin (B).
Inventors:
YAMADA MASASHI (JP)
HIRAKAWA MAKOTO (JP)
NAKAYA TAKASHI (JP)
HIRAKAWA MAKOTO (JP)
NAKAYA TAKASHI (JP)
Application Number:
PCT/JP2013/054453
Publication Date:
September 12, 2013
Filing Date:
February 22, 2013
Export Citation:
Assignee:
TOAGOSEI CO LTD (JP)
International Classes:
C09J177/00; B32B15/088; C09J7/22; C09J7/35; C09J11/06; C09J163/00; C09J171/10; H05K3/28
Foreign References:
| JP2003176470A | 2003-06-24 | |||
| JP2010260924A | 2010-11-18 | |||
| JP2008056820A | 2008-03-13 | |||
| JP2010106169A | 2010-05-13 | |||
| JP2006316234A | 2006-11-24 | |||
| JP2010006905A | 2010-01-14 |
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Claims: