Title:
HALOGEN-FREE FLAME-RETARDANT CURABLE RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATED BOARD, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/053782
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a halogen-free flame-retardant curable resin composition having excellent dielectric properties, adhesion properties and flame retardancy; a prepreg comprising a curable resin composition and a base material; a metal-clad laminated board; and a printed wiring board. The halogen-free flame-retardant curable resin composition comprises (A) a radical-polymerizable compound having a carbon-carbon unsaturated double bond in the molecule thereof, (B) a phosphorus-based flame-retardant agent, (C) an alkoxyimino (NOR)-type hindered amine compound and (D) a radical polymerization initiator, the resin composition being characterized in that the content of phosphorus is 1.0 to 5.0% by mass relative to the total amount of the components (A) and (B) and the content of the component (C) is 0.2 to 5.0 parts by mass relative to the total amount, i.e., 100 parts by mass, of the components (A) and (B).
Inventors:
WASANO TSUGUTOSHI (JP)
Application Number:
PCT/JP2022/031755
Publication Date:
April 06, 2023
Filing Date:
August 23, 2022
Export Citation:
Assignee:
NIPPON STEEL CHEMICAL & MAT CO LTD (JP)
International Classes:
C08L101/02; C08F2/44; C08F257/00; C08F290/06; C08F299/00; C08J5/24; C08K5/3435; C08K5/49; C08L25/02; H05K1/03
Domestic Patent References:
| WO2021060178A1 | 2021-04-01 | |||
| WO2020262253A1 | 2020-12-30 |
Foreign References:
| JP2022052593A | 2022-04-04 | |||
| JP2019189682A | 2019-10-31 | |||
| JP2015067797A | 2015-04-13 |
Attorney, Agent or Firm:
SASAKI Kazuya et al. (JP)
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