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Title:
HALOGEN-FREE PHOSPHORUS-FREE SILICON RESIN COMPOSITION, AND PREPREG, LAMINATED BOARD, COPPER-CLAD PLATE USING SAME, AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2016/101588
Kind Code:
A1
Abstract:
Provided are a halogen-free phosphorus-free silicon resin composition, and prepreg and laminated board using the same, and printed circuit board, the silicon resin composition comprising the following components in parts by solid weight: 50-90 parts of an organic silicon resin, 20-80 parts of a vinyl-terminated silicon oil, 0.1-5 parts of a viscosity enhancing agent, 0-60 parts of a filler, 0.0001-0.5 parts of a catalyst, and 0.00001-0.1 parts of an inhibitor, a mole ratio between Si-H in a cross-linking agent and Si-Vi in the organic silicon resin being 1.0-1.7. The resin body of the resin composition is a thermosetting silicon resin, and the laminated board prepared thereby has good heat and flame resistance and an extremely low dielectric constant (Dk) and dielectric loss (Df).

Inventors:
SU XIAOSHENG (CN)
YE SUWEN (CN)
TANG GUOFANG (CN)
Application Number:
PCT/CN2015/083407
Publication Date:
June 30, 2016
Filing Date:
July 06, 2015
Export Citation:
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Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08L83/07; B32B15/08; B32B27/04; C08J3/09; C08L83/05; H05K1/03
Foreign References:
CN102433005A2012-05-02
CN103497488A2014-01-08
JPH09111124A1997-04-28
JP5463586B22014-04-09
US20020146575A12002-10-10
Other References:
See also references of EP 3239246A4
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
北京品源专利代理有限公司 (CN)
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