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Title:
HALOGENATED RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/085003
Kind Code:
A1
Abstract:
The present invention relates to a halogenated resin composition comprising a plasticizer, a polymeric dispersant, a basic inorganic filler, and a halogenated resin, wherein the polymeric dispersant contains a structural unit having a carboxy group and a structural unit having a hydrophobic group, the degree of neutralization of the polymeric dispersant is 30 mol% or less, and the weight-average molecular weight (Mw) of the polymeric dispersant is 4,000-200,000.

Inventors:
TAKIGUCHI OSAMU (JP)
WADA SATOSHI (JP)
Application Number:
PCT/JP2022/038608
Publication Date:
May 19, 2023
Filing Date:
October 17, 2022
Export Citation:
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Assignee:
KAO CORP (JP)
International Classes:
C08L27/04; C08K3/013; C08K3/26; C08L11/00; C08L101/08
Foreign References:
JP2003327762A2003-11-19
JPH09278961A1997-10-28
JPH09124868A1997-05-13
JPH0625587A1994-02-01
JP2013513009A2013-04-18
CN1462773A2003-12-24
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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