Title:
HARD COATING FILM AND TARGET FOR FORMING HARD COATING FILM
Document Type and Number:
WIPO Patent Application WO/2017/033527
Kind Code:
A1
Abstract:
Provided are: a hard coating film having excellent thermal oxidation resistance; and a hard coating film that serves as a target for forming the above-described hard coating film and has the following composition. (AlaCrbSccMd)(C1-e-fNeOf) In this connection, a represents the atomic ratio of Al; b represents the atomic ratio of Cr; c represents the atomic ratio of Sc; d represents the atomic ratio of an arbitrary element M; e represents the atomic ratio of N; f represents the atomic ratio of O; a, b, c, d, e and f satisfy 0.60 < a < 0.90, 0.0 < b < 0.40, 0.0 < c < 0.40, 0.0 ≤ d < 0.20, a + b + c + d = 1.0, 0.0 ≤ e ≤ 1.0, 0.0 ≤ f ≤ 1.0 and 0.0 ≤ e + f ≤ 1.0; and the arbitrary element M is composed of one or more elements selected from the group consisting of Y, B, Si, V, W, Hf, Zr, Nb, Ta, Mo, Ce and Ge.
Inventors:
NIWA TSUKASA (JP)
OOGUCHI MASAYUKI (JP)
AOMATSU AKIHIRO (JP)
OOGUCHI MASAYUKI (JP)
AOMATSU AKIHIRO (JP)
Application Number:
PCT/JP2016/067224
Publication Date:
March 02, 2017
Filing Date:
June 09, 2016
Export Citation:
Assignee:
YUKEN IND CO LTD (JP)
International Classes:
C23C14/06; C23C14/32; B21D37/01; B21J13/02
Foreign References:
JP2009263717A | 2009-11-12 | |||
JP2009001906A | 2009-01-08 | |||
JP2004514061A | 2004-05-13 |
Attorney, Agent or Firm:
OKUBO, Katsuyuki (JP)
Download PDF:
Previous Patent: THERMAL ANALYSIS APPARATUS
Next Patent: LEAD DEVICE, ATTACHMENT TOOL, POWER SUPPLY SYSTEM, AND POWER SUPPLY METHOD
Next Patent: LEAD DEVICE, ATTACHMENT TOOL, POWER SUPPLY SYSTEM, AND POWER SUPPLY METHOD