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Patent Searching and Data


Title:
HEADPHONE CABLE
Document Type and Number:
WIPO Patent Application WO/2016/203758
Kind Code:
A1
Abstract:
Provided is a headphone cable comprising a conduction body combining high conductivity with excellent tensile strength and resistance to bending. In this invention, an insulated wire comprises: a copper-silver alloy wire containing 0.5 to 10% by mass of Ag with the remaining portion consisting of Cu and unavoidable impurities; and an insulation cover film on the surface thereof. A plurality of the insulated wires are twisted together into a twisted wire, wherein the twisting pitch is 5 to 20 times the external diameter of the twisted wire. Furthermore, this headphone cable comprises a plurality of the twisted wires grouped together to form a cable core, and a protection cover provided at the outer periphery of the cable core.

Inventors:
SAKAGAMI YOSHIHIRO (JP)
ODACHI GO (JP)
Application Number:
PCT/JP2016/002844
Publication Date:
December 22, 2016
Filing Date:
June 13, 2016
Export Citation:
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Assignee:
SWCC SHOWA CABLE SYSTEMS CO LTD (JP)
International Classes:
H01B11/00; C22C9/00
Foreign References:
JP2009249660A2009-10-29
JP2015021138A2015-02-02
Attorney, Agent or Firm:
SAKURA PATENT OFFICE, p. c. (JP)
Patent business corporation cherry tree international patent firm (JP)
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