Title:
A HEAT CONDUCTING AND DISSIPATING STRUCTURE FOR WHITE LIGHT LED PACKAGE
Document Type and Number:
WIPO Patent Application WO/2007/041902
Kind Code:
A1
Abstract:
A heat conducting and dissipating structure for white light LED package comprises
two metal leadframes. The top of one of the leadframe is a cup which is provided
with a blue light emitting crystal and a fluorescent powder adhesive layer. The
two wire leading from the blue light emitting crystal is connected with the two
leadframes, respectively. The top of the two leadframes are packaged with a colorless
and transparent resin. The upper surface and the lower surface of the blue light
emitting crystal are provided with a heat conducting and dissipating adhesive
layer, respectively, which is packaged the blue light emitting crystal. The
fluorescent powder adhesive layer is provided on the upper heat conducting and
dissipating adhesive layer. As a result, the heat radiating from the blue light
emitting crystal is conducted to the leadframes via the two heat conducting and
dissipating adhesive layer rapidly, and dissipated out via the feet of the leadframes.
Inventors:
LI XUELIN (CN)
Application Number:
PCT/CN2005/001802
Publication Date:
April 19, 2007
Filing Date:
October 31, 2005
Export Citation:
Assignee:
LI XUELIN (CN)
International Classes:
H01L23/34; H01L33/64; H01L33/50
Foreign References:
| US20020093287A1 | 2002-07-18 | |||
| US6921927B2 | 2005-07-26 | |||
| JP2004303854A | 2004-10-28 | |||
| CN1564330A | 2005-01-12 |
Attorney, Agent or Firm:
GUANGZHOU SINO PATENT & TRADEMARK AGENCY CO., LTD. (No. 87 Cangbian Roa, Guangzhou Guangdong 0, CN)
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