Title:
HEAT-CONDUCTING LAYER, PHOTOSENSITIVE LAYER, PHOTOSENSITIVE COMPOSITION, METHOD FOR PRODUCING HEAT-CONDUCTING LAYER, AND LAMINATE AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/203178
Kind Code:
A1
Abstract:
A heat-conducting layer that contains at least one type of filler, has thermal diffusivity of 5.0 x 10-7m2s-1 or higher, and has volume resistivity of 1.0 x 1011 Ω∙cm or higher is used. The present invention also relates to a photosensitive layer, a photosensitive composition, a method for producing a heat-conducting layer, and a laminate and a semiconductor device to which this heat-conducting layer is applied.
Inventors:
YAMASHITA KOSUKE (JP)
SHIMADA KAZUTO (JP)
SHIMADA KAZUTO (JP)
Application Number:
PCT/JP2019/016086
Publication Date:
October 24, 2019
Filing Date:
April 15, 2019
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08L101/00; C08K3/01; C08L33/04; C08L63/00; C08L79/08; G03F7/004; G03F7/32; H01L23/373
Foreign References:
| JP2006337481A | 2006-12-14 | |||
| JP2010234678A | 2010-10-21 | |||
| JP2013080916A | 2013-05-02 | |||
| JPH03295863A | 1991-12-26 | |||
| JPH05261948A | 1993-10-12 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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