Title:
HEAT CONDUCTION DEVICE
Document Type and Number:
WIPO Patent Application WO2005059465
Kind Code:
B1
Abstract:
A heat conduction device is fixed into a radiator (2) and abutted a heat-generating component (42). This radiator (2) has a through-hole (10). The heat conduction device includes a column body (1). One end of the column body (1) is recessed to form a hollow part in order to increase the radiating surface; the other end of the column body (1) is a contact surface (12). The outer surface of the column body (1) is fixed inside the through-hole (10) of the radiator (2), the contact surface (12) is abutted the heat generating component (42); Due to the formation of the hollow part, the radiating surface is increased, the radiating effect is enhanced, and the cost can be decreased greatly due to the simple configuration of the column body (1).
Inventors:
HU JUN-LIANG (CN)
Application Number:
PCT/US2004/041677
Publication Date:
September 09, 2005
Filing Date:
December 10, 2004
Export Citation:
Assignee:
MOLEX INC (US)
HU JUN-LIANG (CN)
HU JUN-LIANG (CN)
International Classes:
F28F1/12; H01L23/40; H01L23/467; H01L23/367; (IPC1-7): F28F1/12; H01L23/467
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