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Patent Searching and Data


Title:
HEAT CONDUCTION DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/116754
Kind Code:
A1
Abstract:
This heat conduction device comprises a heat source unit (10), a temperature control face (11), and a heat conduction unit (12). The heat source unit generates at least one of heat or cold. The temperature control face is partitioned into a plurality of temperature control units, and at least some of the plurality of temperature control units are disposed away from the heat source unit. The plurality of heat conduction units is connected between the heat source unit and the plurality of temperature control units so as to conduct heat. In this way, the plurality of partitioned temperature control units can be directly heated or cooled by heat from the heat source unit. Thus, even a temperature control unit disposed far from the heat source unit can be heated or cooled in the same way as a temperature control unit disposed near the heat source unit, and the entire temperature control face can be regulated to a uniform temperature.

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Inventors:
JINNOH MASANORI (JP)
OTA AUN (JP)
OSHIMA HISAYOSHI (JP)
HIRAMATSU HIDEHIKO (JP)
KANEKO TAKASHI (JP)
Application Number:
PCT/JP2017/042492
Publication Date:
June 28, 2018
Filing Date:
November 28, 2017
Export Citation:
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Assignee:
DENSO CORP (JP)
International Classes:
F24D3/16; B60H1/00
Foreign References:
JPH10131390A1998-05-19
JP2014240269A2014-12-25
JPS55180188U1980-12-24
CA2638238A12010-01-24
US20160017603A12016-01-21
JP2010038470A2010-02-18
JP2015092101A2015-05-14
Attorney, Agent or Firm:
JIN Shunji (JP)
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