HEAT CONDUCTION SHEET - KITAGAWA IND CO LTD

Title:

HEAT CONDUCTION SHEET

Document Type and Number:

WIPO Patent Application WO/2020/090499

Kind Code:

A1

Abstract:

The present invention has: a heat conduction member 12 that is disposed on a first side with respect to a heat source H and is disposed between the heat source H and a heat dissipation member R thermally connected to the heat source H; and a high relative permeability member 14 that is disposed at at least a portion of the vicinity of the heat conduction member 12 and has a relative permeability μ exceeding 1. Accordingly, the heat from the heat source can be efficiently transmitted to the heat dissipation member and can thus be dissipated, and the radiation of electromagnetic waves from the heat source can be suppressed.

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Inventors:

MATSUZAKI TORU (JP)
KAWAGUCHI YASUHIRO (JP)
SAITO MASAHIRO (JP)
MITSUYA KENSUKE (JP)
ITO MASAAKI (JP)
OMORI TOSHIYUKI (JP)

Application Number:

PCT/JP2019/040896

Publication Date:

May 07, 2020

Filing Date:

October 17, 2019

Export Citation:

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Assignee:

KITAGAWA IND CO LTD (JP)

International Classes:

H01L23/373; H01F1/12; H01L23/00; H01L23/36; H05K7/20; H05K9/00

Foreign References:

JP2002185183A	2002-06-28
CN204335258U	2015-05-13
JP2017162988A	2017-09-14
JP2006108388A	2006-04-20