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Title:
HEAT-CONDUCTIVE ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2014/021090
Kind Code:
A1
Abstract:
A heat-conductive adhesive sheet is provided with a metal layer and a heat-conductive adhesive agent layer laminated on at least one surface of the metal layer. The heat-conductive adhesive agent layer contains: an adhesive component that is produced by polymerizing a monomer component comprising a (meth)acrylic acid alkyl ester; and heat-conductive particles. The monomer component contains substantially no carboxyl-group-containing monomer.

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JP2011153190CONDUCTIVE ADHESIVE TAPE
Inventors:
TERADA YOSHIO (JP)
FURUTA KENJI (JP)
NAKAYAMA JUNICHI (JP)
TOJO MIDORI (JP)
Application Number:
PCT/JP2013/069219
Publication Date:
February 06, 2014
Filing Date:
July 12, 2013
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J7/28; C09J9/00; C09J11/04; C09J133/06
Domestic Patent References:
WO1998024860A11998-06-11
WO1998023700A11998-06-04
Foreign References:
JPH10316953A1998-12-02
JPH10324853A1998-12-08
JPH10330692A1998-12-15
JP2005325250A2005-11-24
JP2009280729A2009-12-03
JP2012036366A2012-02-23
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
Hiroyuki Okamoto (JP)
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