Title:
HEAT-CONDUCTIVE COMPOSITION AND HEAT-DISSIPATING GREASE
Document Type and Number:
WIPO Patent Application WO/2024/101031
Kind Code:
A1
Abstract:
[Problem] To provide a heat-conductive composition that has excellent heat-dissipating performance and that does not loosen bolts. [Solution] Provided is a heat-conductive composition comprising a first inorganic powder filler, a second inorganic powder filler, and a third inorganic powder filler having an average particle size of 10-100 μm, 1-50 μm, and 0.1-5 μm, respectively. The average particle size ratio of the second filler with respect to the first filler is not more than 0.8 times; the average particle size ratio of the third filler with respect to the second filler is not more than 0.6 times; with respect to all inorganic powder fillers, which is 100 vol%, the first filler is 40-80 vol%, the second filler is 10-50 vol%, and the third filler is 10-40 vol%. The heat-conductive composition further comprises a base oil, a wax-type resin demonstrating a penetration of at least 5 and having a melting point of 40-150°C, a rosin-based resin having a melting point of 40-150°C. With respect to the entire resin content, which is 100 parts by volume, the base oil is 100-1000 parts by volume, and the content ratio of the wax-based resin is 10-60 vol%.
Inventors:
OZAWA MAKOTO (JP)
Application Number:
PCT/JP2023/035727
Publication Date:
May 16, 2024
Filing Date:
September 29, 2023
Export Citation:
Assignee:
SUMITOMO METAL MINING CO (JP)
International Classes:
C08L93/04; C08K3/013; C08L91/06; C09K5/14
Domestic Patent References:
| WO2021182550A1 | 2021-09-16 | |||
| WO2021182549A1 | 2021-09-16 | |||
| WO2021182548A1 | 2021-09-16 |
Foreign References:
| JP2021143249A | 2021-09-24 |
Attorney, Agent or Firm:
SHINOHARA & COMPANY INTERNATIONAL PATENT FIRM (JP)
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