Title:
HEAT-CONDUCTIVE MATERIAL, RESIN COMPOSITION, AND DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/131007
Kind Code:
A1
Abstract:
As a heat-conductive material having high thermal conductivity as well as high heat resistance, the present invention provides a heat-conductive material including a disc-shaped compound, e.g., a heat-conductive material including a cured material of a resin composition including a disc-shaped compound having two or more functional groups, the functional groups being selected from a (meth)acrylic group, a (meth)acrylamide group, an oxiranyl group, an oxetanyl group, a hydroxyl group, an amino group, a thiol group, an isocyanate group, a carboxyl group, and a carboxylic acid anhydride group. The present invention furthermore provides a device including the heat-conductive material, and provides the abovementioned resin composition.
Inventors:
TAKAHASHI KEITA (JP)
Application Number:
PCT/JP2017/002469
Publication Date:
August 03, 2017
Filing Date:
January 25, 2017
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C09K5/14; C08G59/20; C08L33/06; C08L101/00
Foreign References:
| JPS6086192A | 1985-05-15 | |||
| JPH10307208A | 1998-11-17 | |||
| JP2000119652A | 2000-04-25 |
Other References:
KANG, DONG-GUE ET AL.: "Heat Transfer Organic Materials: Robust Polymer Films with the Outstanding Thermal Conductivity Fabricated by the Photopolymerization of Uniaxially Oriented Reactive Discogens", ACS APPL. MATER. INTERFACES, vol. 8, no. 44, 9 November 2016 (2016-11-09), pages 30492 - 30501, XP055564710, ISSN: 1944-8244, DOI: 10.1021/acsami.6b10256
Attorney, Agent or Firm:
SIKS & CO. (JP)
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