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Patent Searching and Data


Title:
HEAT-CONDUCTIVE SHEET, METHOD FOR INSTALLING SAME, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2022/163192
Kind Code:
A1
Abstract:
A heat-conductive sheet of the present invention comprises: a binder component which is a mixture of a silicone matrix (A) and a hydrocarbon compound (B); and a heat-conductive filler (C) which is dispersed in the binder component, wherein the content of the hydrocarbon compound (B) is 2.0 to 20 parts by mass relative to 100 parts by mass of the total of the silicone matrix (A) and the hydrocarbon compound (B), and the expansion rate X is at least -1.5% but less than 0%, as measured by a thermomechanical analyzer (TMA) under conditions of the compressive load being 0.01N, the measurement temperature being 30-80°C, and the rate of temperature increase being 2°C per minute. According to the present invention, it is possible to provide a heat-conductive sheet that has excellent heat conductivity and is capable of suppressing expansion under high temperatures.

Inventors:
KUDOH HIROKI (JP)
NAMIKI KAZUHIRO (JP)
IWAZAKI HIROMICHI (JP)
KUROO KENTA (JP)
Application Number:
PCT/JP2021/046531
Publication Date:
August 04, 2022
Filing Date:
December 16, 2021
Export Citation:
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Assignee:
SEKISUI POLYMATECH CO LTD (JP)
International Classes:
B32B27/00; B32B7/027; B32B27/18; C08J5/18; C08L83/04; H01L23/36; H01L23/373; H05K7/20
Domestic Patent References:
WO2020050334A12020-03-12
Foreign References:
CN112194898A2021-01-08
JP2002280207A2002-09-27
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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