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Patent Searching and Data


Title:
HEAT CONDUCTIVE SHEET AND METHOD FOR PRODUCING HEAT CONDUCTIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2015/151604
Kind Code:
A1
Abstract:
Provided are: a heat conductive sheet which exhibits excellent adhesion between an acrylic resin layer and a supporting sheet; and a method of producing this heat conductive sheet. This heat conductive sheet comprises: a heat conductive resin layer (11) that is formed of an acrylic heat conductive composition; and a supporting resin layer (a supporting sheet) (12) that contains a polyvinyl acetal resin and a styrene-vinyl isoprene block copolymer. Since the supporting sheet is crosslinked with an acrylic monomer in the acrylic heat conductive resin layer, adhesion between the heat conductive resin layer and the supporting sheet can be improved.

Inventors:
MATSUSHIMA MASAYUKI (JP)
Application Number:
PCT/JP2015/053958
Publication Date:
October 08, 2015
Filing Date:
February 13, 2015
Export Citation:
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Assignee:
DEXERIALS CORP (JP)
International Classes:
B32B27/30; H01L23/36; H05K7/20
Domestic Patent References:
WO2009081877A12009-07-02
WO2012014757A12012-02-02
WO2012005270A12012-01-12
Foreign References:
JP2008042168A2008-02-21
JP2004288825A2004-10-14
JP2012158695A2012-08-23
Attorney, Agent or Firm:
NOGUCHI, NOBUHIRO (JP)
Nobuhiro Noguchi (JP)
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