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Patent Searching and Data


Title:
HEAT CONDUCTIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2022/176823
Kind Code:
A1
Abstract:
A heat conductive sheet (1) has a sheet body (2) and a resin coating layer (5) formed on one surface (2a) and the other surface (2b) of the sheet body (2), contains a polymer matrix, an anisotropic filler, and one or more non-anisotropic materials, and has the anisotropic filler oriented in the thickness direction, wherein the surface of the heat conductive sheet is a sliced surface, the specific gravity of at least one non-anisotropic material is 5 or more, the specific gravity of the heat conductive sheet is 2.7 or more, and the heat conductivity of the heat conductive sheet is 4 W/mK or more.

Inventors:
ARAMAKI KEISUKE (JP)
KUBO YUSUKE (JP)
Application Number:
PCT/JP2022/005790
Publication Date:
August 25, 2022
Filing Date:
February 15, 2022
Export Citation:
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Assignee:
DEXERIALS CORP (JP)
International Classes:
H01L23/36; H01L23/373; H05K7/20
Foreign References:
JP2017175080A2017-09-28
JP2020129628A2020-08-27
JP2020004805A2020-01-09
JP2020017723A2020-01-30
Attorney, Agent or Firm:
TORANOMON INTELLECTUAL PROPERTY FIRM (JP)
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