Title:
HEAT-CURABLE ADHESIVE COMPOSITION, LAYERED FILM, CONNECTED STRUCTURE, AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/199845
Kind Code:
A1
Abstract:
A heat-curable adhesive composition comprising a photocleavable compound which cleaves upon radiation irradiation to generate an amine compound and a heat-curable resin which cures upon heating in the presence of the amine compound; and a layered film comprising a substrate film and an adhesive layer disposed on a surface of the substrate film, wherein the adhesive layer is made of the heat-curable adhesive composition.
Inventors:
TSUNASHIMA YUKA (JP)
NATSUKAWA MASANORI (JP)
NATSUKAWA MASANORI (JP)
Application Number:
PCT/JP2023/014292
Publication Date:
October 19, 2023
Filing Date:
April 06, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C09J5/06; C09J7/35; C09J11/04; C09J11/06; C09J11/08; C09J201/00; H01L21/52
Domestic Patent References:
| WO2010041670A1 | 2010-04-15 | |||
| WO2018038221A1 | 2018-03-01 |
Foreign References:
| JP2021181406A | 2021-11-25 | |||
| JP2011001422A | 2011-01-06 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF: