Title:
HEAT-CURABLE ADHESIVE SHEET AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/104669
Kind Code:
A1
Abstract:
Provided are: a heat-curable adhesive sheet that reduces warping of a semiconductor wafer and reduces the occurrence of chipping; and a production method for a semiconductor device. The heat-curable adhesive sheet has a heat-curable adhesive layer comprising a resin composition that has a heat-curable adhesive agent layer containing a filler and a resin component including (meth) acrylate and a polymerization initiator. The (meth) acrylate includes a solid (meth) acrylate and a trifunctional or higher (meth) acrylate. The resin component has at least 55 wt% solid (meth) acrylate. The total value obtained when the number of functional groups per unit molecular weight of the (meth) acrylate is multiplied by the percentage of (meth) acrylate contained in the resin component is at least 2.7E-03. The filler blending amount is 80-220 parts by mass, relative to 100 parts by mass resin component.
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Inventors:
MORI DAICHI (JP)
ISHIMATSU TOMOYUKI (JP)
ISHIMATSU TOMOYUKI (JP)
Application Number:
PCT/JP2016/087089
Publication Date:
June 22, 2017
Filing Date:
December 13, 2016
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
C09J4/02; C09J7/10; C09J11/04; C09J11/06; H01L21/301; H01L21/304
Foreign References:
| JP2008218930A | 2008-09-18 | |||
| JP2007273768A | 2007-10-18 | |||
| JP2015019012A | 2015-01-29 | |||
| JP2010106244A | 2010-05-13 | |||
| JP2011082368A | 2011-04-21 |
Attorney, Agent or Firm:
NOGUCHI, Nobuhiro (JP)
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