HEAT-CURABLE COMPOSITION, CURED ARTICLE, ADHESIVE AGENT, AND HEAT-CURABLE COMPOSITION PRODUCTION METHOD

WIPO Patent Application WO/2023/249123

A1

This heat-curable composition according to the present disclosure comprises: a first component including a siloxane having an epoxy group, and a second component including at least one of: a phenol having a structure in which a ring-opening functional group (but excluding a hydroxy group), which is a functional group that has an action for opening a ring of an epoxy group, is bonded to a benzene ring; and an acyclic aliphatic compound having a structure in which the ring-opening functional group is bonded to an end thereof. The heat-curable composition production method according to the present disclosure comprises: a first component preparation step for preparing a first component including a siloxane having an epoxy group; a second component preparation step for preparing a second component including at least one of a phenol having a structure in which a ring-opening functional group (but excluding a hydroxy group), which is a functional group that has an action for opening a ring of an epoxy group, is bonded to a benzene ring, and an acyclic aliphatic compound having a structure in which the ring-opening functional group is bonded to an end thereof; and a mixing step for mixing the first component and the second component.

KANEKO YOSHIRO (JP)
NAKAGAWA HIDEO (JP)
OZAI TOSHIYUKI (JP)
AKETA TAKASHI (JP)

PCT/JP2023/023478

December 28, 2023

June 26, 2023

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UNIV KAGOSHIMA (JP)
SHINETSU CHEMICAL CO (JP)

C08G59/30; C09J163/00

CN111394053A	2020-07-10
JP2003301026A	2003-10-21
US20020127406A1	2002-09-12
JP2013210603A	2013-10-10
JPH02151624A	1990-06-11
JP2004002784A	2004-01-08

KIMURA Mitsuru et al. (JP)

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