Title:
HEAT-CURABLE COMPOSITION, SURFACE SEALING MATERIAL FOR ORGANIC EL ELEMENT, AND CURED OBJECT OBTAINED THEREFROM
Document Type and Number:
WIPO Patent Application WO/2014/199626
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a heat-curable composition which can form a cured layer having a highly smooth surface on an object to be coated, e.g., an organic EL element, with little ruggedness or cissing. This heat-curable composition comprises (A) a cationically polymerizable compound having two or more cationically polymerizable functional groups in the molecule, (B) an initiator for thermal cationic polymerization, (C) a polyether compound (which is not the compound having cationically polymerizable functional groups), and (D) a leveling agent. The composition has a viscosity, as measured with an E-type viscometer at 25°C and 2.5 rpm, of 50-30,000 mPa·s.
Inventors:
YAMAMOTO YUGO
OKABE JUN
OKABE JUN
Application Number:
PCT/JP2014/003074
Publication Date:
December 18, 2014
Filing Date:
June 10, 2014
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
C08L63/00; C08K5/00; C08L33/04; C08L71/02; C08L83/04; H01L51/50; H05B33/04; H05B33/10
Foreign References:
| JP2013018921A | 2013-01-31 | |||
| JP2009203431A | 2009-09-10 | |||
| JP2008031424A | 2008-02-14 |
Attorney, Agent or Firm:
WASHIDA, KIMIHITO (JP)
Koichi Washida (JP)
Koichi Washida (JP)
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