HEAT CURABLE COMPOSITION AND USES THEREFOR

WIPO Patent Application WO/2022/080403

A1

Provided is a heat curable composition that can be used to easily and efficiently produce a molded body having excellent heat resistance and mechanical characteristics as well as low dielectric characteristics.　The heat curable composition is prepared by combining a heat curable polyarylene ether-based resin and a fluorene compound represented by formula (1). (In the formula, ring Z1 and ring Z2 are the same or different from each other and each represent an arene ring; A1 and A2 are the same or different from each other and each represent an alkylene group; n1 and n2 are the same or different from each other and each represent an integer that is equal to or greater than 0; R1 and R2 are the same or different from each other and each represent a hydrogen atom or a methyl group; R3 and R4 are the same or different from each other and each represent a substituent; m1 and m2 are the same or different from each other and each represent an integer that is equal to or greater than 0; R5 represents a substituent; and k represents an integer from 0-8.)

YASUDA YUICHIRO (JP)
MITSUZANE MAYATO (JP)
MIYAUCHI SHINSUKE (JP)

PCT/JP2021/037857

April 21, 2022

October 13, 2021

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OSAKA GAS CHEMICALS CO LTD (JP)

C08L71/12; C08F290/06; C08K5/103; C08K5/3477; C08L71/00

WO2021153315A1	2021-08-05
WO2021166847A1	2021-08-26

JP2020136546A	2020-08-31
CN106633035A	2017-05-10
JP2014218659A	2014-11-20
JP2005162785A	2005-06-23
JP2021031530A	2021-03-01
JP2021127438A	2021-09-02
JP2007501876A	2007-02-01
CN107163244A	2017-09-15
US20170174835A1	2017-06-22

SAKANAKA Hiroshi et al. (JP)

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