Title:
HEAT-CURABLE PERFLUOROPOLYETHER RUBBER COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/210400
Kind Code:
A1
Abstract:
This heat-curable perfluoropolyether rubber composition contains specific proportions of (A) a perfluoropolyether polymer having a specific structure which has two or more alkenyl groups in the molecular chain thereof, (B) a fluorine-containing organohydrogen polysiloxane which has two or more hydrogen atoms bonded to a silicon atom in each molecule thereof, (C) a hydrosilylation reaction catalyst and (D) a hydrophobic silica powder which has a BET specific surface area of 50m2/g or higher. As a result, this heat-curable perfluoropolyether rubber composition is capable of producing a cured article (perfluoropolyether rubber cured article) which has excellent heat resistance, chemical resistance, solvent resistance, low-temperature dependence, rubber properties (mechanical strength, elongation properties, etc.) and the like while also exhibiting excellent injection molding properties and mold release properties.
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Inventors:
ASAHI TOMOYUKI (JP)
Application Number:
PCT/JP2023/015105
Publication Date:
November 02, 2023
Filing Date:
April 14, 2023
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L71/00; C08K3/013; C08K3/36; C08K5/541
Domestic Patent References:
| WO2021095621A1 | 2021-05-20 |
Foreign References:
| JP2016145354A | 2016-08-12 | |||
| JP2016523311A | 2016-08-08 |
Attorney, Agent or Firm:
PATENT ATTORNEY CORPORATION EI-MEI PATENT OFFICE (JP)
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