Title:
HEAT-CURABLE POLYIMIDE RESIN COMPOSITION AND MOLDED ARTICLE THEREOF
Document Type and Number:
WIPO Patent Application WO/2021/020553
Kind Code:
A1
Abstract:
This heat-curable polyimide resin composition and molded article thereof contain a compound represented by Formula (1) and a heat-curable polyimide resin, and thereby have excellent flame retardancy, and excellent reliability at high temperatures (heat resistance and heat stability) as a resin molded product.
Inventors:
NANTAKU JUNJI (JP)
Application Number:
PCT/JP2020/029406
Publication Date:
February 04, 2021
Filing Date:
July 31, 2020
Export Citation:
Assignee:
OTSUKA CHEMICAL CO LTD (JP)
International Classes:
C09K21/10; C08K5/5399; C08L79/08; C09K21/12; H01L23/29; H01L23/31; H05K1/03
Foreign References:
| JPH08225714A | 1996-09-03 | |||
| CN103896985A | 2014-07-02 | |||
| US3865783A | 1975-02-11 | |||
| JP2012233067A | 2012-11-29 | |||
| JP2012193300A | 2012-10-11 |
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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