Title:
HEAT-CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2019/142752
Kind Code:
A1
Abstract:
Provided is a heat-curable resin composition which rarely undergoes dripping or bleeding even when used for the hole plugging in a printed wiring board which has holes, such as through-holes, each having a large opening size, and is particularly prevented from the occurrence of cracking even when used for the hole plugging in a multi-layer printed wiring board in which a conductive part and an insulated part are provided in an inner wall of each of holes such as through-holes. The heat-curable resin composition according to the present invention is characterized in that the viscosity ratio R represented by the formula V2/V1 is 5.0 × 10-2 to 1.0 × 102 wherein V1 (dPa•s) represents a viscosity as measured in accordance with JIS-Z8803:2011 using a cone-and-plate rotary viscometer (a corn-and-plate type) and V2 (dPa•s) represents a smallest value of a melt viscosity at 60 to 100°C as measured in accordance with JIS-K7244-10:2005, and is also characterized in that the pencil hardness as measured by the pencil hardness test in accordance with JIS-K5600-5-4:1999 is HB or harder when the heat-curable resin composition is heated at 100°C for 160 minutes.
Inventors:
NOGUCHI TOMOTAKA (JP)
KANAZAWA YASUYO (JP)
HARIMA EIJI (JP)
ARAI YASUAKI (JP)
KANAZAWA YASUYO (JP)
HARIMA EIJI (JP)
ARAI YASUAKI (JP)
Application Number:
PCT/JP2019/000832
Publication Date:
July 25, 2019
Filing Date:
January 15, 2019
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
C08L63/00; C08G59/50; C08K3/00; H05K3/28; H05K3/42
Domestic Patent References:
| WO2002044274A1 | 2002-06-06 |
Foreign References:
| JP2002141662A | 2002-05-17 | |||
| JPH1075027A | 1998-03-17 | |||
| JPH11302504A | 1999-11-02 | |||
| JP2005251895A | 2005-09-15 |
Attorney, Agent or Firm:
NAGAI Hiroshi et al. (JP)
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