Title:
HEAT DIFFUSION SHEET
Document Type and Number:
WIPO Patent Application WO/2016/159238
Kind Code:
A1
Abstract:
Provided is a heat diffusion sheet which has a high thermal conductivity in the spreading direction, and which can be re-used even if peeled off from an object to which the heat diffusion sheet is to be attached. Provided is a heat diffusion sheet 2 that is provided with, laminated in sequence from a graphite sheet 10 which has a thickness equal to or greater than 20 µm but smaller than 80 µm, an acrylic adhesive layer 21 which has a thickness of 5-15 µm, and which does not contain a thermal conductive material, a polyester film 22 which has a thickness of 5-30 µm, and a silicon adhesive layer 23 which is thinner than the polyester film 22, has a thickness of 2-25 µm, does not contain a thermal conductive material, and has a peeling strength of 0.005-1.0 N/cm. Heat generated by the object to which the silicon adhesive layer 23 is to be attached is easily transferred to the graphite sheet 10, and the heat diffusion sheet 2 is easily peeled off and re-used.
Inventors:
NAGASHIMA MINORU (JP)
HIYAMA TERUO (JP)
HIYAMA TERUO (JP)
Application Number:
PCT/JP2016/060664
Publication Date:
October 06, 2016
Filing Date:
March 31, 2016
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
H05K7/20; B32B9/04; H01L23/36; H01L23/373
Domestic Patent References:
WO2008149920A1 | 2008-12-11 | |||
WO2015151613A1 | 2015-10-08 |
Foreign References:
JP2010001191A | 2010-01-07 | |||
JP2007261087A | 2007-10-11 | |||
JP2010254979A | 2010-11-11 | |||
JP2010219290A | 2010-09-30 |
Attorney, Agent or Firm:
ISHIJIMA, Shigeo et al. (JP)
Shigeo Ishijima (JP)
Shigeo Ishijima (JP)
Download PDF: