Title:
HEAT DISSIPATER, HEAT-DISSIPATING STRUCTURE, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/166584
Kind Code:
A1
Abstract:
Provided is a heat dissipater having excellent heat-dissipating properties and capable of suppressing radiation of unwanted electromagnetic waves.
A heat dissipater 1 in use is directly or indirectly thermally connected to a heat source 30 generating electromagnetic waves in a frequency band of 0.1 to 1000 MHz, and is made of a resin molded body. The heat dissipater 1 is provided with: a plate-like portion 2 having a major surface 2b; and a ground connecting portion 4 which is provided so as to protrude from the major surface 2b of the plate-like portion 2, and which is connected to ground. The heat dissipater 1 has a thermal conductivity in an in-plane direction of not less than 3 W/(m･K), and the volume resistivity of the heat dissipater 1 is not less than 1.0×10-2Ω･cm and less than 1.0×108Ω･cm.
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Inventors:
SUENAGA YUUSUKE (JP)
MATSUMURA RYUUJI (JP)
MATSUMOTO HIROKAZU (JP)
MATSUMURA RYUUJI (JP)
MATSUMOTO HIROKAZU (JP)
Application Number:
PCT/JP2020/005242
Publication Date:
August 20, 2020
Filing Date:
February 12, 2020
Export Citation:
Assignee:
SEKISUI TECHNO MOLDING CO LTD (JP)
International Classes:
H01L23/36; H05K7/20; H05K9/00
Foreign References:
| JP2018125320A | 2018-08-09 | |||
| JP2018186286A | 2018-11-22 | |||
| JP2009182182A | 2009-08-13 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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