Title:
HEAT DISSIPATING APPARATUS FOR ELECTRONIC ELEMENTS
Document Type and Number:
WIPO Patent Application WO/2021/158026
Kind Code:
A1
Abstract:
Provided is a heat dissipating apparatus for electronic elements which has the minimum size but has improved heat dissipating performance. To this end, the heat dissipating apparatus for electronic elements, according to the present invention, comprises: a heat dissipating housing having an internal space; a shield case formed of a thermally conductive material, wherein the shield case is disposed in the heat dissipating housing and partitions the internal space into a first chamber which is a vacuum space to be filled with a refrigerant and a second chamber which is a non-vacuum space; and a printed circuit board which is disposed in the shield case and has a heat dissipating element. The shield case evaporates the refrigerant by using sensible heat transferred from the heat dissipating element to the shield case and latent heat transferred from the shield case to the first chamber.
Inventors:
JI KYO SUNG (KR)
JEONG BAE MOOK (KR)
CHOI IN HWA (KR)
JEONG BAE MOOK (KR)
CHOI IN HWA (KR)
Application Number:
PCT/KR2021/001451
Publication Date:
August 12, 2021
Filing Date:
February 04, 2021
Export Citation:
Assignee:
KMW INC (KR)
International Classes:
H01Q1/02; H05K7/20; H05K9/00
Foreign References:
| US20190320557A1 | 2019-10-17 | |||
| KR200263467Y1 | 2002-02-04 | |||
| EP3570299A1 | 2019-11-20 | |||
| KR20180001423U | 2018-05-11 | |||
| US20040075986A1 | 2004-04-22 |
Attorney, Agent or Firm:
SUAN INTELLECTUAL PROPERTY (KR)
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